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Dissoluble polyimide resin, and preparation method

A polyimide resin and soluble technology, which is applied in the field of soluble polyimide resin and its preparation method, can solve the problem of reduced dimensional stability, large dimensional changes of laminated boards, and decreased elasticity of polyimide resin layers and other problems, to achieve the effect of excellent heat resistance and high dimensional stability

Inactive Publication Date: 2006-12-06
CHANG CHUN PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the application of too many long-chain monomers will cause the elasticity of the polyimide resin layer to decrease, and the increase in the linear expansion coefficient will lead to a large change in the size of the prepared laminate and a decrease in dimensional stability.
[0005] In addition, polyimide acid resin usually cannot be dissolved in organic solvents after dehydration dead cycle, thus greatly reducing its applicability

Method used

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  • Dissoluble polyimide resin, and preparation method
  • Dissoluble polyimide resin, and preparation method
  • Dissoluble polyimide resin, and preparation method

Examples

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preparation example Construction

[0030] The preparation of PBTDA can be obtained by existing methods, for example, Japanese Patent No. 43-5911 uses benzene and toluene as solvents, and is prepared by reacting anhydrous chlorides with glycols; The product is obtained by transesterifying anhydrous acid compound trimellitic anhydride (TMA, Trimelltic Anhydride) with diesters in a solvent-like solvent. The PBTDA preparation method is shown in Reaction Formula 1.

[0031] Reaction 1

[0032]

[0033] The preparation of BHEBPDA can be obtained by existing methods, such as using BHEBP and TMA to carry out transesterification reaction, and this method is disclosed in Japanese patent application JP10-330306. The synthesis method of BHEBPDA is shown in Reaction Formula 2.

[0034] Reaction 2

[0035]

[0036] Wherein, based on the total amount of dianhydride monomers, the content of dianhydride monomers represented by formula (I) is preferably 5 to 20 mole %; the 3,3',4,4'-diphenylmethyl The content of the ke...

Embodiment 1

[0064] Put 24.6 grams of APP (0.06 mol) and 160 grams of NMP into a four-neck reactor with a stirrer and a nitrogen conduit for dissolution. The nitrogen flow rate is 20cc / min. After stirring evenly and dissolving, maintain 15°C.

[0065] Take four flasks with stirring bars respectively, put 2.94 g of BPDA (0.01 mol) and 10 g of NMP into the first flask and stir to dissolve them. 1.34 grams of PBTDA (0.0025 moles) and 10 grams of NMP were placed in the second flask and stirred to dissolve. The solutions in the first and second flasks were added into the reaction kettle, nitrogen gas was continuously introduced, and the reaction was carried out with stirring for 1 hour.

[0066] Put 3.1 g of ODPA (0.01 mol) and 10 g of NMP into the third flask, stir to dissolve them. The solution in the flask was added to the reaction kettle, nitrogen gas was continuously introduced, and the reaction was carried out with stirring for 1 hour.

[0067] Put 12.08 grams of BTDA (0.0375 moles) and...

Embodiment 2 to Embodiment 10

[0071] Repeat the step of Example 10, the molar amount of each component is as shown in Table 1.

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Abstract

This invention provides a method for preparing a polyimide resin. The method comprises: (1) polymerizing dianhydride monomer and diamine monomer to obtain polyamic acid resin; (2) imidizing to obtain the polyimide resin. The chemical formulae of the two monomers are shown in formulae I and II, respectively. In formula I, R is O or -O (CH2)nO-, and n is an integer among 0-2. The polyimide resin has such advantages as improved water absorbency, low thermal expansion coefficient, good thermal resistance and high size stability.

Description

technical field [0001] The invention relates to a polyimide resin and its preparation method, in particular to a soluble polyimide resin and its preparation method. Background technique [0002] In recent years, due to the thinning and miniaturization requirements of electronic and communication equipment, the packaging volume of integrated circuits in the equipment is also developing towards miniaturization and thinning, and the wiring circuit boards used are also becoming more and more miniaturized. Among various wiring circuit boards, flexible printed circuit boards can greatly reduce the volume and weight of electronic components, and are a commonly used wiring circuit board. [0003] Generally, the structure of the flexible printed circuit board includes an insulating substrate and a metal conductor layer. The insulating substrate and the metal conductor layer are bonded with an adhesive to form a circuit laminate. Copper foil is usually used as the material of the meta...

Claims

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Application Information

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IPC IPC(8): C08G73/10C09D179/08
Inventor 黄坤源杜安邦巫胜彦
Owner CHANG CHUN PLASTICS
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