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Piezoelectric element and method for manufacturing the same

A technology for piezoelectric elements and manufacturing methods, which is applied to the manufacture/assembly of electrical elements, piezoelectric/electrostrictive devices, piezoelectric devices/electrostrictive devices, etc., and can solve the problems of reduced tensile strength, reduced resistance, complex Detect problems such as circuits to achieve the effect of inhibiting moisture absorption and maintaining electrical characteristics

Inactive Publication Date: 2006-12-13
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, signal processing corresponding to changes in the flexibility of the piezoelectric element is required, and a complicated detection circuit is also required due to the possibility of false detection.
[0005] In addition, the tensile strength of the piezoelectric element decreases due to the softening of the piezoelectric element, so the durability decreases
In particular, piezoelectric ceramic powders containing alkali metals and alkaline earth metals in Group I and Group II of the periodic table have low resistivity and are easily dissolved in water, so the resistance is significantly reduced

Method used

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  • Piezoelectric element and method for manufacturing the same
  • Piezoelectric element and method for manufacturing the same
  • Piezoelectric element and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0036] figure 1 It is a cross-sectional view of the chip piezoelectric element according to Embodiment 1 of the present invention. In the piezoelectric element, an electrode 2A as a first electrode and an electrode 2B as a second electrode are formed on both surfaces of a sheet-shaped piezoelectric composition pressure sensitive body (hereinafter referred to as pressure sensitive body) 1 . The electrode 2A and the electrode 2B are insulated from each other.

[0037] FIG. 2 is a schematic diagram showing a cross-sectional structure of the pressure sensitive body 1 . The pressure sensitive body 1 includes waterproof piezoelectric ceramic powder 3 and flexible organic polymer 4 . The piezoelectric ceramic powder 3 and the organic macromolecule 4 treated with waterproofing are in a uniformly dispersed state.

[0038] image 3 It is a schematic cross-sectional view of a particle of the waterproof-treated piezoelectric ceramic powder 3 . The waterproof-treated piezoelectric cer...

Embodiment approach 2

[0166] 7 is a cross-sectional view of a chip piezoelectric element according to Embodiment 2 of the present invention. The piezoelectric element shown in FIG. 7 is different from the piezoelectric element of Embodiment 1 in that a piezoelectric composition pressure sensitive body (hereinafter referred to as pressure sensitive body) 7 is provided with a covering layer 8 made of a waterproof material. .

[0167] The sheet pressure sensitive body 7 has the piezoelectric ceramic powder 5 and the flexible organic polymer 4 described in the first embodiment. Among them, the piezoelectric ceramic powder 5 has not been treated for waterproofing. The cover layer 8 is formed by subjecting the surface of the pressure-sensitive body 7 to waterproof treatment. Electrodes 2A and 2B are formed on the surface of cover layer 8 as in the first embodiment. In FIG. 7, the cover layer 8 is provided on the surface where the electrodes 2A, 2B are formed. That is, the cover layer 8 covers at leas...

Embodiment approach 3

[0175] 9 is a cross-sectional view of a chip piezoelectric element according to Embodiment 3 of the present invention. The difference between the piezoelectric element shown in FIG. 9 and the piezoelectric element of Embodiment 1 lies in that a waterproof material is provided on the surface of the piezoelectric composition pressure sensitive body (hereinafter referred to as the pressure sensitive body) 7 and the electrodes 2A, 2B. The covering layer 9 formed of material is provided with a protective layer 10 covering and protecting them.

[0176] The sheet-shaped pressure sensitive body 7 has the piezoelectric ceramic powder 5 described in the first embodiment and the flexible organic polymer 4 . Covering layer 9 is formed by subjecting the surfaces of electrodes 2A and 2B and part of the surface of pressure sensitive body 7 to water repellent treatment. Furthermore, a protective layer 10 covering the pressure-sensitive body 7 , the electrodes 2A, 2B, and the covering layer 9...

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Abstract

A piezoelectric element is provided with a piezoelectric composition pressure sensitive body, a first electrode, a second electrode and a coat layer. The piezoelectric composition pressure sensitive body includes a piezoelectric ceramic powder and a flexible organic polymer. The first electrode and the second electrode are connected with the piezoelectric composition pressure sensitive body and are insulated from one another. The coat layer is provided on the outer side of the piezoelectric ceramic powder and suppresses absorption of water into the piezoelectric ceramic powder.

Description

technical field [0001] The present invention relates to a piezoelectric element using a piezoelectric composition pressure-sensitive body formed by mixing piezoelectric ceramic powder with an organic polymer, and more particularly to a flexible piezoelectric element that can be used as a pressure-sensitive sensor and its manufacturing method . technical background [0002] JP-A-11-201835 discloses a piezoelectric composition pressure-sensitive body excellent in piezoelectricity and flexibility. The piezoelectric composition pressure sensitive body is formed by mixing and kneading materials containing at least one of titanium coupling agent, piezoelectric ceramic powder, chlorinated polyethylene or chlorosulfonated polyethylene. Since the kneaded material contains thermoplastic elastomers such as chlorinated polyethylene, it is flexible and can be processed into a sheet or cable. The molded body thus processed is a piezoelectric composition pressure-sensitive body, and is u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L41/08G01L1/16H01L41/22H01L41/26H10N30/00H10N30/098
Inventor 福田祐桥田卓藤井优子野村幸生伊藤修治佐佐木隆宏
Owner PANASONIC CORP
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