Method for measuring several critical strain values of metal membrane in flexible substrate

A technology for metal thin films and flexible substrates, which is applied in the field of testing several critical strain values ​​of metal thin films, can solve the problem that the determination method has not been reported before, and achieve the effect of reducing the sudden failure of devices

Inactive Publication Date: 2007-03-07
山东合创涂层技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For a long time, great attention has been paid to this problem at home and abroad, but there have been no reports about the specific determination method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The polyimide flexible substrate is processed into a traditional tensile sample shape, the narrow and long area in the middle (20×6mm) is the effective working area of ​​the sample, and the wide areas at both ends are the tensile clamping area. Using magnetron sputtering technology to deposit metal Cu film on the effective working area, the film thickness is 200 nm, the deposition process parameters are: sputtering power 150W; sputtering bias -80V; background pressure 4.5×10 -3 Pa; working pressure (Ar) 0.1Pa. Use a micro-tensile machine with a range of 250N to stretch the metal film / flexible substrate system to measure the stress σ-strain ε curve of the metal film, and use resistance testing equipment to measure the relative change Δ of the metal film resistance with the strain ε during the stretching process; through scanning The microscope continuously observes the microstructure change of the metal film during the stretching process, and draws the microcrack percent...

Embodiment 2

[0016] The polyimide flexible substrate is processed into a traditional tensile sample shape, the narrow and long area in the middle (20×6mm) is the effective working area of ​​the sample, and the wide areas at both ends are the tensile clamping area. Using magnetron sputtering technology to deposit metal Al film on the effective working area, the film thickness is 1.2 microns, the deposition process parameters are: sputtering power 200W; sputtering bias -70V; background pressure 3.0×10 -3 Pa; working pressure (Ar) 0.2Pa. The metal film / flexible substrate system was stretched by a micro-tensile machine with a measuring range of 250N, and the resistance test equipment was used to measure the relative change of the metal film resistance Δ with the change of the strain ε during the stretching process; the metal film was continuously observed during the stretching process through a scanning microscope. Changes in microstructure, draw the percentage of microcracks f-strain ε curve....

Embodiment 3

[0018] The polyimide flexible substrate is processed into a traditional tensile sample shape, the narrow and long area in the middle (20×6mm) is the effective working area of ​​the sample, and the wide areas at both ends are the tensile clamping area. Using magnetron sputtering technology to deposit metal Cu film on the effective working area, the film thickness is 2.5 microns, the deposition process parameters are: sputtering power 120W; sputtering bias -80V; background pressure 4.5×10 -3 Pa; working pressure (Ar) 0.1Pa. The metal film / flexible substrate system was stretched by a micro-tensile machine with a measuring range of 250N, and the resistance test equipment was used to measure the relative change of the metal film resistance Δ with the change of the strain ε during the stretching process; the metal film was continuously observed during the stretching process through a scanning microscope. Changes in microstructure, draw the percentage of microcracks f-strain ε curve....

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Abstract

This invention discloses one current load metal film stretching stress value test describing method, which comprises the following steps: processing current load and micro force stretching on the good metal film of interface; during this process recording the metal film stress curve and resistance change curve; acquiring the crack percentage stress curve through micro analysis by observing metal film. The current load metal film and flexible base board system invalid threshold system is composed of three threshold stress, such as the stress from resistance change to stress curve from linear phase to non-linear conversion; micro crack percentage stress curve back reducing as zero theory into threshold extension stress; resistance change to stress curve resistance runaway time into threshold crack unstable stress.

Description

technical field [0001] The invention relates to a method for testing several critical strain values ​​of metal thin films in industries such as microelectronics, in particular to a method for testing several critical strain values ​​of metal thin films on flexible substrates. Background technique [0002] Flexible circuit boards are widely used in VLSI and microelectromechanical systems (MEMS). Usually, metal thin film materials (such as Cu and Al) used as metallized wiring are deposited on the flexible substrate to form a metal thin film / flexible substrate. system. As a metal structure thin film material for engineering, its plasticity or critical fracture strain is an extremely important index, which can be used for material safety design and life prediction. For a free metal film or a metal thin film deposited on a rigid substrate, its tensile properties are usually locally destabilized and rapidly fractured after destabilization, so it is easy to directly determine its ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N27/04G01N27/20G01N3/08G01N1/28
Inventor 孙军刘刚牛荣梅丁向东江峰宋忠孝徐可为
Owner 山东合创涂层技术有限公司
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