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Method of forming powder compact and mold assembly for powder compaction

A technology of forming bodies and forming dies, which is applied in the direction of material forming presses, manufacturing tools, presses, etc., and can solve problems such as difficulty in producing formed bodies and lack of dense coatings

Inactive Publication Date: 2007-03-07
DIAMET CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the prior art described in the above-mentioned document 1, the lubricant dispersed in water is in the state of solid powder, that is, the solid powder of the lubricant is applied to the molding die in the state of being dispersed and mixed in water, so no dense powder is formed. film, making it difficult to produce stable moldings

Method used

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  • Method of forming powder compact and mold assembly for powder compaction
  • Method of forming powder compact and mold assembly for powder compaction
  • Method of forming powder compact and mold assembly for powder compaction

Examples

Experimental program
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Embodiment 1

[0038] Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 4 . Fig. 1 shows the first step. In this figure, 1 is a through hole formed on the main body of the molding die 2, which is the side of the powder compact A, which will be described later. The lower punch 3 is closed, while the upper punch 4 is fitted from above the through hole 2 . Further, a feeder 5 which is a raw material supply body for supplying the raw material powder M is slidably provided on the upper surface of the die 2 . Moreover, above the through hole 2, there is provided a spraying unit 6, which is an attachment device for spraying an aqueous solution L of a lubricant to be described later, to adhere the aqueous solution L to the forming part 1A. It is connected to a tank (not shown) of the aqueous solution L through an automatic on-off valve (not shown). In addition, a heater 7 and a temperature detection part 8 are provided around the molding part 1...

Embodiment 2

[0067] 5 to 8 show the second embodiment, and the same reference numerals are assigned to the same parts as those of the above-mentioned embodiment 1, and detailed description thereof will be omitted. On the surface 10 of the through hole 1, in order to improve the wettability of the aqueous solution L on the surface 10, a surface treatment layer 11 is provided by performing a hydrophilic treatment and disposing a hydrophilic material. When the contact angle X of the above-mentioned surface treatment layer 11 and the above-mentioned aqueous solution L is smaller than the contact angle Y (X<Y) of the surface 10 formed by the material of the mold 2 itself or the top surface 2A of the directly exposed material and the above-mentioned aqueous solution L (X<Y), The aforementioned wettability can be improved. In addition, the measurement of the above-mentioned contact angles X and Y is not in the state illustrated for explanation, but is performed under the same conditions such as k...

Embodiment 3

[0075] 9 to 10 show the third embodiment, and the same reference numerals are attached to the same parts as those of the first and second embodiments described above, and the detailed description thereof will be omitted. In Example 2, in order to reduce the wettability of the above-mentioned aqueous solution L with respect to the above-mentioned top surface 2A on the top surface 2A of the mold 2 slidably provided with the feeder 5, that is, to improve the water repellency (hydrophobic) property, by performing Hydrophobic treatment, or disposing of a hydrophobic material to set up the surface treatment layer 21 . When the contact angle Y' of the above-mentioned surface treatment layer 21 with the above-mentioned aqueous solution L is greater than the contact angle X'(Y '>X'), the above-mentioned wettability can be reduced. The above-mentioned surface treatment layer 21 is formed of materials containing Si-H or C-H bonds, such as silicon-based resins or fluorine-based resins sh...

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Abstract

A molding part (1A) formed in a molding die main body (2) is packed with a raw powder. Thereafter, lower and upper punches (3) and (4) are fitted to the molding part (1A) to form a powder compact. Before packing with the raw powder (M), an aqueous solution (L) obtained by dissolving a water-soluble lubricant having a solubility in 100 g water at 20 DEG C of 3 g or higher in water so as to result in a homogenous phase is adhered to the molding part (1A). The aqueous solution (L) is evaporated to deposit crystals in the molding part (1A) and form a crystalline layer (B). Because of the layer (B), which is a dense layer for lubrication formed on the circumferential wall of the molding part (1A), not only the pressure required for discharging the powder compact (A) from the molding part (1A) can be reduced but the density of the powder compact (A) can be heightened. Furthermore, compacting operations can be successively conducted stably. The objective is to stably obtain a high-density powder compact by forming a dense coating film of a lubricant in a molding part.

Description

technical field [0001] The present invention relates to a method for molding a powder compact formed by filling a powder molding die with raw material powder, and to a powder molding die device. Background technique [0002] The green compact used in the production of sintered parts is formed by press-molding Fe-based, Cu-based, and other raw material powders in a molding die, and then sintering to produce a sintered body. In the molding step, a molded body is molded by pressing with a press machine using a molding die. During pressurization, friction occurs between the formed body and the forming die. Therefore, water-insoluble fatty acid-based lubricants such as zinc stearate, calcium stearate, and lithium stearate are added when mixing the powder to impart lubricity. [0003] However, such a method of mixing a lubricant into the raw material powder has a limit to increase the density of the compact. Therefore, in order to obtain a high-density compact, it has been prop...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/035B22F3/02B30B11/00B30B11/02B30B15/00
CPCB30B15/0011B22F3/02B22F3/03
Inventor 中井崇川濑欣也
Owner DIAMET CORP
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