Low-sintered glass ceramic composite material and its preparing method

A technology of glass ceramics and composite materials, which is applied in the field of preparation of new low-fired glass-ceramic composite materials and new low-fired glass-ceramic composite materials. Effects of sintering time, improved mechanical properties, and high room temperature thermal conductivity

Inactive Publication Date: 2007-03-28
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductivity of the composite material is as high as 11W/m.K, but the hot-pressing process is complicated, and the hot-pressing time is as long as 2 to 8 hours, especially the glass component conta

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] 1) Get 57 grams of aluminum nitride powder and 43 grams of cordierite-based glass powder (which includes the following ingredients: SiO 2 50wt%, Al 2 o 3 20wt%, MgO 16wt%, B 2 o 3 5wt%, P 2 o 5 2.5wt%, Bi 2 o 3 6.5 wt%, whose particle size is 3 μm) wet ball milling for 24 hours to mix evenly, dry, and pass through a 50-mesh sieve; the particle size of the aluminum nitride powder is 5 μm, its nitrogen content is greater than 33 wt%, and its oxygen content is less than 0.6 wt%;

[0015] 2) The obtained undersize is put into a graphite mold, and then placed in a vacuum hot-pressing furnace for hot-pressing sintering. The specific hot-pressing process is: first raise the temperature to 830°C, the heating rate is 40°C / min, and the pressure is 20MPa; Insulate at 830°C for 8 minutes, and increase the pressure to 30MPa; then raise it to 1000°C at 70°C / min, keep the pressure constant for 1h, and then wait for it to cool to obtain a new type of low-fired glass-ceramic c...

Embodiment 2

[0018]1) Get 35 grams of aluminum nitride powder and 65 grams of cordierite-based glass powder (which includes the following ingredients: SiO 2 53wt%, Al 2 o 3 26wt%, MgO 18wt%, B 2 o 3 1.5wt%, ZnO 1.5wt%, its particle size is 5 μm) wet ball milling 24h mix uniformly, dry, pass 50 mesh sieves; Described aluminum nitride powder particle size is 5 μm, and its nitrogen content is greater than 33wt%, and oxygen content is less than 0.6wt%;

[0019] 2) The obtained undersize is put into a graphite mold, and then placed in a vacuum hot-pressing furnace for hot-pressing sintering. The specific hot-pressing process is: first raise the temperature to 850°C, the heating rate is 70°C / min, and the pressure is 10MPa; Insulate at 850°C for 8 minutes, and increase the pressure to 25MPa; then raise it to 1000°C at 40°C / min, keep the pressure constant for 1h, and then cool it down to obtain a new type of low-fired glass-ceramic composite material.

[0020] The technical index of this em...

Embodiment 3

[0022] 1) Get 35 grams of aluminum nitride powder and 65 grams of cordierite-based glass powder (which includes the following ingredients: SiO 2 50wt%, Al 2 o 2 20wt%, MgO 23wt%, B 2 o 3 2.5wt%, P 2 o 5 2.0wt%, CeO 2 2.5 wt%, whose particle size is 4 μm) wet ball milling for 24 hours to mix evenly, dry, and pass through a 50-mesh sieve; the particle size of the aluminum nitride powder is 4 μm, its nitrogen content is greater than 33 wt%, and its oxygen content is less than 0.6 wt%;

[0023] 2) The obtained undersize is put into a graphite mold, and then placed in a vacuum hot-pressing furnace for hot-pressing sintering. The specific hot-pressing process is: first raise the temperature to 800°C, the heating rate is 50°C / min, and the pressure is 15MPa; Insulate at 800°C for 10min, and increase the pressure to 40MPa; then raise it to 900°C at 70°C / min, keep the pressure constant for 1h, and then cool it down to obtain a new type of low-fired glass-ceramic composite mater...

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Abstract

The ivnetnion discloses a novel low temperature-fired glas ceramic composite and the preparing method thereof. And it comprises aluminum nitride and cordierite-based glass in the weight ratio of 35-57 to 65- 43, where the latter comprises SiO2 50-53wt%, Al2O3 20-26wt%,MgO 15-23wt%,B2O3 1.5-5wt%,P2O5 0-2.5wt%,and RxOy 1-6.5wt%, where R in RxOy is one of Bi, Ce and Zn, x=1-2 and y=1-3. When used in advanced electronic package, it has relative density up to above 97.2%, maximum heat conductivity up to 7.5W/m.K, thermal expansion coefficient 3.2- 3.8*10-6K-1, folding strength not lower than 168MPa, fracture toughness not lower than 2.38MPa.m1/2, low dielectric constant, largely improved mechanical properties, etc.

Description

(1) Technical field: [0001] The invention relates to an electronic packaging material, in particular to a novel low-fired glass-ceramic composite material; the invention also relates to a preparation method of the novel low-fired glass-ceramic composite material. (two) background technology: [0002] With the gradual development of electronic components to high power, high density and high integration, a variety of new technologies and new structures have emerged in microelectronic packaging, such as wafer-level module packaging (WSP) and multi-chip packaging (MCP). Wait. These new packaging modes require high-density and high-reliability packaging through low-temperature co-firing of packaging materials and circuit materials. Therefore, advanced packaging technology puts forward higher requirements for packaging materials, namely low sintering temperature (≤1000°C), low dielectric constant (5~6, 1MHz), low dielectric loss (0.001, 1HMz), The coefficient of thermal expansio...

Claims

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Application Information

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IPC IPC(8): C04B35/195C04B35/622
Inventor 陈国华刘心宇
Owner GUILIN UNIV OF ELECTRONIC TECH
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