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Low-sintered glass ceramic composite material and its preparing method

A technology of glass ceramics and composite materials, which is applied in the field of preparation of new low-fired glass-ceramic composite materials and new low-fired glass-ceramic composite materials. Effects of sintering time, improved mechanical properties, and high room temperature thermal conductivity

Inactive Publication Date: 2007-03-28
GUILIN UNIV OF ELECTRONIC TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductivity of the composite material is as high as 11W / m.K, but the hot-pressing process is complicated, and the hot-pressing time is as long as 2 to 8 hours, especially the glass component contains a large amount of toxic substance lead oxide, which is not good for environmental protection
With the advent of the era of green electronics manufacturing, the use of this composite material will be limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] 1) Get 57 grams of aluminum nitride powder and 43 grams of cordierite-based glass powder (which includes the following ingredients: SiO 2 50wt%, Al 2 o 3 20wt%, MgO 16wt%, B 2 o 3 5wt%, P 2 o 5 2.5wt%, Bi 2 o 3 6.5 wt%, whose particle size is 3 μm) wet ball milling for 24 hours to mix evenly, dry, and pass through a 50-mesh sieve; the particle size of the aluminum nitride powder is 5 μm, its nitrogen content is greater than 33 wt%, and its oxygen content is less than 0.6 wt%;

[0015] 2) The obtained undersize is put into a graphite mold, and then placed in a vacuum hot-pressing furnace for hot-pressing sintering. The specific hot-pressing process is: first raise the temperature to 830°C, the heating rate is 40°C / min, and the pressure is 20MPa; Insulate at 830°C for 8 minutes, and increase the pressure to 30MPa; then raise it to 1000°C at 70°C / min, keep the pressure constant for 1h, and then wait for it to cool to obtain a new type of low-fired glass-ceramic c...

Embodiment 2

[0018]1) Get 35 grams of aluminum nitride powder and 65 grams of cordierite-based glass powder (which includes the following ingredients: SiO 2 53wt%, Al 2 o 3 26wt%, MgO 18wt%, B 2 o 3 1.5wt%, ZnO 1.5wt%, its particle size is 5 μm) wet ball milling 24h mix uniformly, dry, pass 50 mesh sieves; Described aluminum nitride powder particle size is 5 μm, and its nitrogen content is greater than 33wt%, and oxygen content is less than 0.6wt%;

[0019] 2) The obtained undersize is put into a graphite mold, and then placed in a vacuum hot-pressing furnace for hot-pressing sintering. The specific hot-pressing process is: first raise the temperature to 850°C, the heating rate is 70°C / min, and the pressure is 10MPa; Insulate at 850°C for 8 minutes, and increase the pressure to 25MPa; then raise it to 1000°C at 40°C / min, keep the pressure constant for 1h, and then cool it down to obtain a new type of low-fired glass-ceramic composite material.

[0020] The technical index of this em...

Embodiment 3

[0022] 1) Get 35 grams of aluminum nitride powder and 65 grams of cordierite-based glass powder (which includes the following ingredients: SiO 2 50wt%, Al 2 o 2 20wt%, MgO 23wt%, B 2 o 3 2.5wt%, P 2 o 5 2.0wt%, CeO 2 2.5 wt%, whose particle size is 4 μm) wet ball milling for 24 hours to mix evenly, dry, and pass through a 50-mesh sieve; the particle size of the aluminum nitride powder is 4 μm, its nitrogen content is greater than 33 wt%, and its oxygen content is less than 0.6 wt%;

[0023] 2) The obtained undersize is put into a graphite mold, and then placed in a vacuum hot-pressing furnace for hot-pressing sintering. The specific hot-pressing process is: first raise the temperature to 800°C, the heating rate is 50°C / min, and the pressure is 15MPa; Insulate at 800°C for 10min, and increase the pressure to 40MPa; then raise it to 900°C at 70°C / min, keep the pressure constant for 1h, and then cool it down to obtain a new type of low-fired glass-ceramic composite mater...

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Abstract

The ivnetnion discloses a novel low temperature-fired glas ceramic composite and the preparing method thereof. And it comprises aluminum nitride and cordierite-based glass in the weight ratio of 35-57 to 65- 43, where the latter comprises SiO2 50-53wt%, Al2O3 20-26wt%,MgO 15-23wt%,B2O3 1.5-5wt%,P2O5 0-2.5wt%,and RxOy 1-6.5wt%, where R in RxOy is one of Bi, Ce and Zn, x=1-2 and y=1-3. When used in advanced electronic package, it has relative density up to above 97.2%, maximum heat conductivity up to 7.5W / m.K, thermal expansion coefficient 3.2- 3.8*10-6K-1, folding strength not lower than 168MPa, fracture toughness not lower than 2.38MPa.m1 / 2, low dielectric constant, largely improved mechanical properties, etc.

Description

(1) Technical field: [0001] The invention relates to an electronic packaging material, in particular to a novel low-fired glass-ceramic composite material; the invention also relates to a preparation method of the novel low-fired glass-ceramic composite material. (two) background technology: [0002] With the gradual development of electronic components to high power, high density and high integration, a variety of new technologies and new structures have emerged in microelectronic packaging, such as wafer-level module packaging (WSP) and multi-chip packaging (MCP). Wait. These new packaging modes require high-density and high-reliability packaging through low-temperature co-firing of packaging materials and circuit materials. Therefore, advanced packaging technology puts forward higher requirements for packaging materials, namely low sintering temperature (≤1000°C), low dielectric constant (5~6, 1MHz), low dielectric loss (0.001, 1HMz), The coefficient of thermal expansio...

Claims

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Application Information

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IPC IPC(8): C04B35/195C04B35/622
Inventor 陈国华刘心宇
Owner GUILIN UNIV OF ELECTRONIC TECH
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