Sliver-powder conducting glue and its production

A technology of conductive adhesive and silver powder, applied in the field of conductive adhesive, can solve the problem of not being able to exist for a long time, and achieve the effect of excellent electrical performance

Inactive Publication Date: 2007-04-04
上海特视精密仪器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, the Chinese Invention Patent Publication No. CN1632032A reports a single-component room temperature curing epoxy resin flexible conductive adhesive, which will be cured within 24 hours at room temperature and cannot be stored for a long time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0025] The preparation method of the above-mentioned silver powder conductive adhesive is: shear and stir each component except the flake silver powder and granular silver powder according to the above formula ratio, mix evenly, then slowly add the flake silver powder and granular silver powder in the formula ratio, and continue stirring until uniform, Finally, the air bubbles are removed by vacuum to prepare the conductive adhesive, and the temperature is controlled not to exceed 60°C during the whole process. In the above method, the epoxy resin used is glycidyl type epoxy such as glycidyl ether bisphenol A type, bisphenol F type epoxy resin, glycidyl ester epoxy resin, or aliphatic epoxy resin, or fat One or several kinds of ring epoxy resins, the epoxy value of the epoxy resin is between 0.4-0.8, the viscosity at 25°C is between 400-50000mPas, and the dosage is 10-20%; the acid anhydride curing agent is a liquid organic acid anhydride , can be one or more of methyl tetrahy...

Embodiment 1

[0027] Embodiment 1: formulate conductive adhesive by the following percentage by weight (%):

[0028] E-51 epoxy resin 18

[0029] Methyltetrahydrophthalic anhydride 10

[0030] Ethylene glycol diglycidyl ether 2

[0031] AMIC-40 accelerator 0.05 (modified product of benzyl dimethylamine, product of Shanghai Baoqing Company)

[0032] Flake silver powder 50

[0033] Granular silver powder 20

[0034] Initial viscosity: 50000mPas, volume resistivity: 2.3×10-4Ω.cm, 53000mPas, 2.3×10-4Ω.cm after 90 days.

Embodiment 2

[0035] Embodiment 2: Prepare conductive adhesive according to the following weight percentage (%) formula:

[0036] E-51 epoxy resin 18

[0037] Methyltetrahydrophthalic anhydride 10

[0038] Ethylene glycol diglycidyl ether 2

[0039] AMIC-50 accelerator 0.05 (modified imidazole, product of Shanghai Baoqing Company)

[0040] Flake silver powder 50

[0041] Granular silver powder 20

[0042] Initial viscosity: 50000mPas, volume resistivity: 2.5×10-4Ω.cm, 53500mPas, 2.6×10-4Ω2.cm after 90 days.

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PUM

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Abstract

Aluminum paste conductive glue and its production are disclosed. The glue consists of epoxy resin 10-20 proportion, acid anhydride curing agent 5-25 proportion, active diluting agent 1-10 proportion, curing improver 0.01-0.1 proportion, flake aluminum paste 5-85 proportion, grain aluminum paste 5-85 proportion. The process is carried out by curing at 120 degree for 30mins, and storing at room temperature for 3 months. The acid anhydride curing agent substitutes 1,3-diazole, dicyanodiamide, organic hydrazide or their modifiers as latent curing agent. It has excellent performances.

Description

technical field [0001] The invention relates to a conductive adhesive used in the electronics industry, more specifically to a single-component silver powder conductive adhesive and a preparation method thereof. Background technique [0002] With the development of the electronics industry, electronic assembly is becoming more and more miniaturized and high-density. Many conductive connections can no longer rely on traditional methods such as welding or plugging, but are realized through conductive glue. One-component epoxy resin silver powder conductive adhesive has become the most widely used and most important conductive adhesive because of its convenient use, good conductivity, high strength and excellent durability, but because it is in a single package, epoxy resin and curing agent, curing When the accelerator is mixed together, the conductive adhesive itself will react slowly until it gels and loses its use value during storage and transportation at room temperature. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J9/02
Inventor 章利球
Owner 上海特视精密仪器有限公司
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