Femto-second laser ture three-D micro-nano-processing center

Abstract

A true-3D fm-class machining center with fs laser is composed of a fs laser generating-amplifying system, a reflector arranged on the laser output path of said laser generating-amplifying system by negative 45-degree angle, a multiple axles linked microbench under said reflector, a focusing lens between said reflector and microbench, a CCD sensor above said reflector, a LCD monitor, and an industrial control computer.

Description

technical field [0001] The invention relates to a true three-dimensional micro-nano processing equipment, which belongs to the field of advanced manufacturing technology, in particular to a femtosecond laser true three-dimensional micro-nano processing center. Background technique [0002] In recent years, with the increasing demand for microsystems, the three-dimensional structure and the diversification of materials have become a hot issue in the field of micro-nano manufacturing. [0003] The traditional MEMS process mainly adopts the silicon micromachining process developed from the IC process, and processes the required structure through mask etching. This process is generally limited to two-dimensional processing. The LIGA technology developed in Germany in the 1980s broke through the limitations of silicon micromachining technology in the manufacture of high aspect ratio structures. At the same time, microdevices made of metal and plastic materials can also be produce...

AI Technical Summary

Problems solved by technology

Based on the above characteristics, the application of femtosecond laser processing in micro-nano processing has great potential, but from the current reports, femtosecond laser surface etching processing is mainly used for simple structural features such as microholes and microgrooves. Although some research institutions try to apply it to three-dimensional structure processing, the actual results are limited to two-dimensional and semi-structural processing of rubber materials.

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