Crystal wafer testing method and structure of LED

Abstract

A method for testing grade of chip on LED includes sticking an adhesive tape at back said chip, cutting it to be multiple LED chip with adhesive tape, contacting P type and N type of electrodes on those chips by detection card with multiple detection structures in ohm mode, setting a light detector on each of said detection structure, setting these light detector correspondingly above those chips and using them to detect light source emitted by those Led chips.

Description

technical field [0001] The invention relates to a testing method and structure of a light-emitting diode, in particular to a wafer-level testing method and structure of a light-emitting diode. Background technique [0002] The conventional Light Emitting Diode (LED) is composed of P-N junction semiconductors. When the current flows from the P side to the N side, it emits light immediately, and can convert electric energy into a light source with high efficiency. The existing known manufacturing process of light-emitting diodes is to prepare an LED semiconductor wafer first, cut the wafer into LED chips, rearrange them on a belt-shaped conveyor belt, and use probes at both ends to contact the P of a single LED chip. Type electrodes and N-type electrodes, after testing whether they emit light, move the probe and test the next LED chip, so each LED chip is tested one by one, the test time is lengthy, and then each LED chip Individually placed on a substrate (or lead frame), el...

AI Technical Summary

Problems solved by technology

The existing known manufacturing process of light-emitting diodes is to prepare an LED semiconductor wafer first, cut the wafer into LED chips, rearrange them on a belt-shaped conveyor belt, and use probes at both ends to contact the P of a single LED chip. Type electrodes and N-type electrodes, after testing whether they emit light, move the probe and test the next LED chip, so each LED chip is tested one by one, the test time is lengthy, and then each LED chip Individually placed on a substrate (or lead frame), electrically connect the LED chip and the substrate (or lead frame) by wire bonding, then seal the LED chip with a transparent resin or glass cover, and finally test the packaged LED chip again , its manufacturing process and testing require quite a variety of different handling types, resulting in too many manufacturing and testing machines, and the efficiency is not obvious

[0003] It can be seen that the above-mentioned existing test method and structure of light-emitting diodes obviously still have inconvenience and defects in test method, product structure and use, and need to be further improved urgently.

In order to solve the problems existing in the test method and structure of light-emitting diodes, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and the test method and structure of general light-emitting diodes are not suitable. All the test methods and structures can solve the above problems, which is obviously a problem that the relevant industry is eager to solve

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