Laser processing system

Abstract

The present invention relates to a laser processing system. It includes a first laser device for outputting a first wavelength laser beam, the wavelength of said first wavelength laser beam is lambda 1; a first optical component for collecting first wavelength laser beam onto first object processing position of workpiece to be processed; a second laser device for outputting a second wavelength laser beam, the wavelength of said second wavelength laser beam is lambda 2, said lambda 2 is not equal to lambda 1; a second optical component for collecting said second wavelength laser beam onto second object processing position of workpiece to be processed, said second object processing position is different from first object processing position in absorption wavelength; a third laser device for outputting a monitoring laser beam onto the object processing position with shorter absorption wavelength in first object processing position and second object processing position, the wavelength of said monitoring laser beam is positioned in visible light range; and an optical detection device for receiving monitoring laser beam reflected from said object processing position so as to produce a detection signal.

Description

【Technical field】 [0001] The invention relates to a laser processing system for processing materials with high precision. 【Background technique】 [0002] At present, the laser processing system has been widely used in the finishing of various materials, such as cutting, welding, surface treatment, marking, drilling and other finishing of metal, plastic, glass and ceramics; it has fast processing speed, Features such as high precision. Because different materials have different absorption wavelengths; therefore, for laser finishing of different materials, different laser processing systems need to be selected to provide laser beams with suitable wavelengths for material processing. For example, for materials such as glass and ceramics, carbon dioxide laser systems are generally selected; for materials such as metals and plastics, solid-state laser systems are generally selected, such as rubidium-doped yttrium aluminum garnet (Nd:YAG) laser systems. [0003] However, the hig...

AI Technical Summary

Problems solved by technology

However, since the target processing positions of different materials of the workpiece to be processed cannot be processed synchronously, the workpiece to be processed must be switched back and forth between multiple laser processing systems to complete the processing requirements, and the workpiece to be processed needs to be processed during each switching process. The target processing position is repositioned, and the positioning times are too frequent, resulting in low processing accuracy; moreover, switching between multiple laser processing systems for the workpiece to be processed is also a waste of time

In addition, the adoption of multiple laser processing systems will lead to higher overall equipment investment costs

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