Die bonding adhesive tape

Abstract

Disclosed is a die bonding adhesive tape, which eliminates the requirement for additional adhesive tape for attaching a ring frame, decreases the curing time period upon die bonding, essentially prevents the transfer and diffusion of low-molecular-weight compounds between an adhesive film and an adhesive layer on a base substrate to thus exhibit excellent pick-up performance when picking up a die, and easily separates an adhesive film having a die from an adhesive layer on a base substrate when picking up slim and large dies. The die bonding adhesive tape of the invention includes a base substrate and an adhesive layer formed on the base substrate, has a structure in which a core film having a die bonding adhesive film attached thereto is bonded onto the adhesive layer, and enables direct die bonding via dicing and then die pick-up in a state of being mounted on a wafer.

Description

technical field [0001] The present invention relates generally to a die-bonding adhesive tape, and more particularly, to a die-bonding adhesive tape for improving work efficiency and shortening work time in a semiconductor manufacturing process. Background technique [0002] In the semiconductor manufacturing process, a wafer having a large diameter is disassembled into small chips after a dicing process, and the disassembled chiplets are subjected to a series of processes including cleaning, drying, expanding, picking, and bonding with a lead frame. In this way, an adhesive tape is used in order to prevent chip splashing in the dicing process. While the adhesive tape needs to be strong enough to hold the die from the slicing process to the drying process, its adhesion should be significantly reduced during the pick-up process so that the die can be safely transferred to the die-bonding process. process. [0003] Further, in the die bonding process, the chip transferred to...

AI Technical Summary

Problems solved by technology

However, since most of the UV-curable low-molecular-weight compounds of the adhesive layer (10) have been transferred and diffused into the adhesive layer (8) before the ultraviolet light irradiation, the adhesiveness cannot be significantly reduced when the ultraviolet light is irradiated. Attachment

In addition, when the chip size is not smaller than 10 mm × 10 mm and the thickness is 75 μm or less, the adhesive force between the adhesive film adhered to the chip and the adhesive layer on the substrate is not significantly reduced, thus increasing the difficulty of chip pickup

In addition, when the chip pick-up process is barely performed, the chip will be damaged due to the pick-up pressure, which is not desirable

In addition, described phenomenon also occurred in prior art one

Therefore, the adhesive tapes disclosed in prior art 1 and prior art 2 have many limitations when picking up thin and large chips

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