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High-melting point polyamide thermosol composition and method of making the same

A technology of polyamide hot-melt adhesive and composition, which is applied in the direction of monocarboxylate copolymer adhesives, adhesives, adhesive types, etc., can solve unfavorable use, poor low temperature resistance of polyamide hot-melt adhesives, poor flexibility

Inactive Publication Date: 2007-07-04
SHANGHAI LIGHT IND RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyamide hot melt adhesives with high melting points generally have poor low temperature resistance and poor flexibility, which is not conducive to use at low temperatures

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] High melting point dimer acid type polyamide resin (softening point 170 ℃, low temperature resistance 5 ℃, trade name TOHMIDE170, purchased from Japan Fuji Chemical Co., Ltd.) 72 grams, ethylene-acrylic acid copolymer (DOW3460, purchased from U.S. Dow Company ) 16 grams, polyethylene wax (VESTOWAX, purchased from Germany - Degussa company) 12 grams and antioxidant 1010 0.5 grams, first with a mixer (GF300 model, Zhangjiagang Tong Plastic Company, stirring speed 70 rpm) Stir and mix for one hour, then add it into a twin-screw extruder (TES-35 model, Nanjing Ruiya Company), control the heating temperature to 155°C, the extrusion speed to 20Hz, the water temperature to 15°C, and the cutting speed to 1000 rpm. A high-melting point polyamide hot-melt adhesive product with a softening point of 160-170°C, a melt viscosity of 4000-5000mPa.s / 200°C, a tensile elongation of >400%, and a low temperature resistance of -40°C.

Embodiment 2

[0058] 85 grams of high melting point dimer acid type polyamide resin identical with embodiment 1, ethylene-vinyl acetate copolymer (UNC3170, purchased from Japan UNC company) 13 grams, ethylene-acrylic acid copolymer (DOW3460, purchased from U.S. Dow Company) 2 grams and 10 g of antioxidant 1010 1 gram, first use the mixer identical with embodiment 1 to stir and mix at the same rotating speed for one hour, then add in the twin-screw extruder identical with embodiment 1, control heating temperature 165°C, extrusion speed 22Hz, water temperature 18°C, pelletizing speed control 1200 rpm, to obtain a modified high melting point polyamide hot melt adhesive product, the softening point of this product is 165-175°C, and the melt viscosity is 4500-7000mPa .s / 200°C, tensile elongation > 300%, low temperature resistance -30°C.

Embodiment 3

[0060] 88 grams of high-melting point dimer acid type polyamide resin identical with embodiment 1, ethylene-vinyl acetate copolymer (UNC3170, purchased from Japan UNC company) 11 grams, antioxidant 1076 1 gram, same with embodiment 1 earlier The mixer was stirred and mixed for one hour, then added to the same twin-screw extruder as in Example 1, controlled at a heating temperature of 170°C, an extrusion speed of 30Hz, a water temperature of 22°C, and a cutting speed of 1250 rpm to obtain a modified High-melting point polyamide hot-melt adhesive product, the softening point of this product is 170-180°C, the melt viscosity is 6500-8000mPa.s / 200°C, the tensile elongation is >200%, and the low temperature resistance is -20°C.

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Abstract

The invention provides a polyamide hot melt adhesive composite and the method for preparing the same. Said composite comprises: (a) polyamide hot melt adhesive with weight proportion being 70- 95 and melting point being 160- 220 Deg. C, (b) ethylene- vinyl acetate copotymeers and / or ethylene- acrylate copolymer with weight proportion being 5- 30, taking total weight of said compound in (a) and (b) as basis. The compound is characterized by high melting point, low-temperature resistance, goog flexibility and oil- resistant property.

Description

technical field [0001] The invention relates to a polyamide hot-melt adhesive composition and a preparation method thereof, in particular to a polyamide hot-melt adhesive composition with good low temperature resistance and a preparation method thereof. Background technique [0002] Polyamide hot-melt adhesive is a kind of widely used hot-melt adhesive. It is a multi-component copolymer obtained by polycondensation reaction of two or more monomers in a certain proportion. Polyamide hot melt adhesive has high bonding strength, good thermal stability, good medium resistance, and has good bonding performance to wood, metal, ceramics, fabric, paper, phenolic resin, polyethylene, etc. [0003] However, polyamide hot melt adhesives with high melting points generally have poor low temperature resistance and poor flexibility, which is not conducive to use at low temperatures. Contents of the invention [0004] The object of the present invention is to provide a polyamide hot-melt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/00B29B9/12B29C47/40C09J131/04C09J123/08
Inventor 蒋伟王建平
Owner SHANGHAI LIGHT IND RES INST
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