Apparatus and method for controlled application of reactive vapors to produce thin films and coatings

Abstract

A vapor phase deposition method and apparatus for the application of thin layers and coatings on substrates. The method and apparatus are useful in the fabrication of electronic devices, micro-electromechanical systems (MEMS), Bio-MEMS devices, micro and nano imprinting lithography, and microfluidic devices. The apparatus used to carry out the method provides for the addition of a precise amount of each of the reactants to be consumed in a single reaction step of the coating formation process. The apparatus provides for precise addition of quantities of different combinations of reactants during a single step or when there are a number of different individual steps in the coating formation process. The precise addition of each of the reactants in vapor form is metered into a predetermined set volume at a specified temperature to a specified pressure, to provide a highly accurate amount of reactant.

Description

[0001] This application is related to Provisional Application Ser. No. 60 / 482,861, filed Jun. 27, 2003 and entitled: "Method And Apparatus for Mono-Layer Coatings"; Provisional Application Ser. No. 60 / 506,846, filed Sep. 30, 2003, and entitled: ""Method Of Thin Film Deposition"; and, Provisional Application Ser. No. 60 / 482,861, filed Oct. 9, 2003, and entitled: "Method of Controlling Monolayer Film Properties".[0002] 1. Field of the Invention[0003] The present invention pertains to apparatus and a method useful in the deposition of a coating on a substrate, where the coating is formed from chemically reactive species present in a vapor which is reacted with the substrate surface.[0004] 2. Brief Description of the Background Art[0005] Both integrated circuit (IC) device fabrication and micro-electromechanical systems (MEMS) fabrication make use of layers or coatings of material which are deposited on a substrate for various purposes. In some instances, the layers are deposited on a s...

AI Technical Summary

Benefits of technology

[0060] The resulting coated surface is typically very hydrophobic, as measured by water contact angle, which is typically about 103.degree. for DDMS films. The surface was particularly smooth, having an RMS of 0.2 nm, with no visible particulation or defects. The measured work of adhesion was reduced up to 3,000 times depending on the specific process / chemistry. Under the conditions provided above, the measured work of adhesion was reduced to about 30 .mu.J.sup.-2. The properties of the vapor deposited films are equivalent to or better than those reported for liquid-phase deposited films. In addition, use of vapor deposition prevents the stiction which frequently occurs during wet processing of the substrate.

Problems solved by technology

Historically, these types of coatings were deposited in the liquid phase, resulting in limited film property control and loss of device yield due to capillary forces.

The apparatus described for producing layers or coatings for use in electronic devices and / or micro-electromechanical systems devices enables application of the layers or coatings, but does not provide sufficient accuracy and repeatability in terms of the amount of the vaporous reactants provided to the substrate surface.

As a result, the precise composition of the layer or coating which is desired may not be available.

Further, the ability to reproduce the same coating reliably, time after time, is diminished due to lack of control over the precise amount of reactants supplied to the coating formation process.

This decreases the product yield and affects the commercial viability of a coating process.

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