Substrate processing apparatus and substrate processing method

Abstract

A transmitting window is provided on one side of a casing opposite to a substrate outlet. An ionizer is provided outside the transmitting window of a cleaning unit. The transmitting window is made of a polyimide resin or an acrylic resin, for example. Weak X-rays emitted from the ionizer pass through the transmitting window to reach the substrate outlet, shutter, spin chuck, guard, and the like in the cleaning unit. The spin chuck comprises a plurality of conductive holding pins.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus and a substrate processing method for performing a given processing to a substrate. [0003] 2. Description of the Background Art [0004] In fabrication steps of a semiconductor device, a liquid crystal display or the like, a substrate such as a semiconductor wafer or a glass substrate is subjected to various processings, for example cleaning, resist-coating, exposure, development, etching, ion-implanting, resist-stripping, formation of an interlayer insulating film, and thermal treatment. [0005] If the substrate is electrostatically charged in the coarse of a series of processings, a discharge phenomenon may cause damage to a circuit pattern on the surface of the substrate or particles such as dust are easily attached on the substrate. For this reason, static eliminators for removal of static electricity on substrates have been developed (refer to JP 9-...

AI Technical Summary

Benefits of technology

[0009] It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of removing static electricity from a substrate even in a flammable atmosphere and a corrosive atmosphere without the generation of particles.

[0010] It is another object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of removing static electricity from a substrate more effectively.

Problems solved by technology

If the substrate is electrostatically charged in the coarse of a series of processings, a discharge phenomenon may cause damage to a circuit pattern on the surface of the substrate or particles such as dust are easily attached on the substrate.

The high voltage sparks of the discharge type static eliminator, however, cause the electrodes to be fused and attached on the substrate as particles.

Further, the discharge type static eliminator cannot be used in a flammable atmosphere, because the generated high voltage sparks may cause ignition.

During treatments with highly corrosive chemicals (including chemical solutions, vapors from the chemical solutions, and chemical gases) the corrosive atmosphere may exert adverse influence on the static eliminator.

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