Substrate processing apparatus and substrate processing method

Inactive Publication Date: 2005-02-10
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009] It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method capable of r

Problems solved by technology

If the substrate is electrostatically charged in the coarse of a series of processings, a discharge phenomenon may cause damage to a circuit pattern on the surface of the substrate or particles such as dust are easily attached on the substrate.
The high voltage sparks of the discharge type static eliminator, however, cause the electrodes to be fused and attached on the substrat

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

Examples

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examples

[0143] In each of an inventive example and a comparative example, a substrate W undergone hydrophobic-treatment with HF (hydrogen fluoride) was cleaned and dried under the following conditions, using the cleaning units MPC1 having the structure shown in FIG. 2.

Inventive Example

[0144] Holding pins P with the structure shown in FIG. 5 were used in the inventive example. As a material for each of the holding pins P, PEEK (PK-450CA) prepared by NIPPON POLYPENCO KABUSHIKI GAISHA was employed. During cleaning processing, the substrate W was cleaned with pure water while being rotated by the spin chuck 21. During drying processing, the substrate W was dried by shaking off the pure water while being rotated by the spin chuck 21. A polyimide resin film was employed for the transmitting window 6.

[0145] The shield plate 22 was fixed on a position about 70 meters above from the surface of the substrate W during the cleaning and drying processings.

[0146] During the cleaning processing, dryin...

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Abstract

A transmitting window is provided on one side of a casing opposite to a substrate outlet. An ionizer is provided outside the transmitting window of a cleaning unit. The transmitting window is made of a polyimide resin or an acrylic resin, for example. Weak X-rays emitted from the ionizer pass through the transmitting window to reach the substrate outlet, shutter, spin chuck, guard, and the like in the cleaning unit. The spin chuck comprises a plurality of conductive holding pins.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a substrate processing apparatus and a substrate processing method for performing a given processing to a substrate. [0003] 2. Description of the Background Art [0004] In fabrication steps of a semiconductor device, a liquid crystal display or the like, a substrate such as a semiconductor wafer or a glass substrate is subjected to various processings, for example cleaning, resist-coating, exposure, development, etching, ion-implanting, resist-stripping, formation of an interlayer insulating film, and thermal treatment. [0005] If the substrate is electrostatically charged in the coarse of a series of processings, a discharge phenomenon may cause damage to a circuit pattern on the surface of the substrate or particles such as dust are easily attached on the substrate. For this reason, static eliminators for removal of static electricity on substrates have been developed (refer to JP 9-...

Claims

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Application Information

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IPC IPC(8): B08B3/02G02F1/13B08B3/10B08B7/00H01L21/00H01L21/304H01L21/683H05F1/00H05F3/06
CPCH01L21/67236H01L21/6719
Inventor ASA, FUMINORI
Owner DAINIPPON SCREEN MTG CO LTD
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