Method of manufacturing disk substrate, and method and device for manufacturing optical disk

a technology of optical disk and substrate, which is applied in the manufacture of optical record carriers, glue vessels, record information storage, etc., can solve the problems of reducing the acceptable tilt value of the objective lens, the wavelength of laser light decreases, and the na of the objective lens increases. achieves the effect of thin substra

Inactive Publication Date: 2005-02-10
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0009] (b) cutting a portion of the plate with the protective layer formed thereon other than an outer edge portion of the protective layer to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.
[0056] fixing means for fixing the other principal plane to the support. According to the second producing apparatus, the second producing method of the present invention for producing an optical disk can be conducted easily.

Problems solved by technology

However, a decrease in the wavelength of laser light and an increase in a NA of the objective lens decrease an acceptable value of tilt.

Method used

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  • Method of manufacturing disk substrate, and method and device for manufacturing optical disk
  • Method of manufacturing disk substrate, and method and device for manufacturing optical disk
  • Method of manufacturing disk substrate, and method and device for manufacturing optical disk

Examples

Experimental program
Comparison scheme
Effect test

first example

[0116]FIG. 9 shows a cross-sectional view illustrating processes of the first example. First, as shown in FIG. 9A, a disk-shaped first substrate 91 and a disk-shaped second substrate 92 are prepared. The first substrate 91 is made of polycarbonate formed by injection molding. The first substrate 91 has a thickness of 1.1 mm, a diameter of 120 mm, and a diameter of a central hole 91a of 15 mm. Pits corresponding to an information signal are formed on one principal plane 91a of the first substrate 91. Furthermore, a reflective film (not shown) made of aluminum with a thickness of 100 nm is formed on one principal plane 91a. The pits and the reflective film on one principal plane 91a form a signal area. The reflective film can be formed by sputtering.

[0117] The second substrate 92 is made of polycarbonate or acrylic resin. The second substrate 92 can be formed by a method for cutting a sheet formed by casting, or injection molding. The second substrate 92 has a thickness of 90 μm, a d...

second example

[0127] In the second example, the case will be described in which the diameter of the central hole 92h of the second substrate 92 and that of the central hole 94h of the protective film 94 are varied in the first example. The description of the same components as those in the first example will be omitted here.

[0128] In the second example, as shown in FIG. 11A, the central holes 92h and 94h are made larger than the central hole 91h of the first substrate 91. More specifically, the diameters of the central holes 92h and 94h are set to be 40 mm. In this configuration, the second substrate 92 is not placed at an inner peripheral edge of the first substrate 91. Therefore, a center cone for fixing an optical disk can be prevented from coming into contact with the second substrate 92 during use of the optical disk, and the second substrate 92 can be prevented from being damaged or peeled off. In particular, by setting the inner peripheral edge of the second substrate 92 to be larger than...

third example

[0130] In the third example, the case will be described in which only the diameter of the central hole 94h of the protective film 94 is different from that in the second example. The description of the same components as those in the second example will be omitted here.

[0131] In the third example, the diameter of the central hole 92h is set to be 40 mm, and that of the central hole 94h is set to be 15 mm. According to this configuration, the same effect as that of the second example can be obtained. Furthermore, according to this configuration, the protective film 94 can prevent the resin 103 from adhering to the first substrate 91 and the table 101.

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Abstract

A method for producing a disk-shaped substrate 10 used for producing an optical disk includes: (a) forming a protective layer 12a that is larger in area than the disk-shaped substrate 10 on a surface of a transparent plate 11a; and (b) cutting a portion of the plate 11a with the protective layer 12a formed thereon other than an outer edge portion of the protective layer 12a to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.

Description

TECHNICAL FIELD [0001] The present invention relates to a method for producing a disk-shaped substrate, a method for producing an optical disk and an apparatus for producing an optical disk. BACKGROUND ART [0002] Optical disks are spreading widely as information recording media for reproducing or recording information using laser light. Optical disks can be classified as a read-only type, a write-once type and a rewritable type. Examples of the read-only optical disks include compact disks and laser disks. Write-once or rewritable optical disks are used as information recording media. Some of these optical disks have a configuration in which an information layer is formed on one principal plane of a transparent substrate (thickness: 1.2 mm) and a protective film is formed thereon. [0003] In recent years, a digital versatile disk (DVD) that is an optical disk with a large capacity has been commercialized. In recording / reproducing of a high-density optical disk such as a DVD, laser li...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B05D3/12B05D5/06G11B7/24G11B7/24038G11B7/26G11B11/105
CPCB29C65/008Y10T156/12B29C65/1403B29C65/1406B29C65/4845B29C65/521B29C65/7811B29C65/7847B29C66/452B29C2035/0877B29C2793/0009B29D17/007B29L2017/005G11B7/24G11B7/24038G11B7/26G11B11/10582B29C65/1435B29C65/1483Y10S156/938B29C65/524B29C65/522B29C65/528Y10T156/1972B29C65/14B29C66/8322B29C66/71B29C66/1122B29C66/73161B29K2023/00B29K2023/38B29K2031/00B29K2033/08B29K2033/12B29K2069/00
Inventor HAYASHI, KAZUHIROHISADA, KAZUYAOHNO, EIJI
Owner PANASONIC CORP
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