Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical supply system

a chemical supply and pump technology, applied in the direction of diaphragm valves, instruments, cleaning using liquids, etc., can solve the problems of increasing the difficulty of avoiding the increase of the scale and complexity of the whole apparatus, and the increase of the cleaning speed of the substrate cleaning apparatus, etc., to achieve easy and rapid compounding, reduce/simplification of the scale of the whole system, and move easily

Inactive Publication Date: 2005-03-03
SIPEC
View PDF6 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a chemical supply system that can easily and rapidly supply a cleaning liquid with a desired concentration. The system includes a chemical supply pump and a connecting flow passage that allows for the mixing of a liquid chemical with a solvent. The chemical supply pump has a compact member with non-permeability and a high anti-corrosion property that is made into a movable wall, which is oscillated in a direction perpendicular to its wall surface by a shaker to change the volume of the flow passage periodically. This allows for the accurate and rapid supply of a cleaning liquid with a desired concentration. The system also includes a chemical supply apparatus that discharges the liquid chemical from a tubule member directly connected to the supply flow passage, which is connected to a supply flow passage that is a passage for a solvent with which the liquid chemical is mixed. The system can suppress the generation of particles and the mixing of liquids in the cleaning liquid, and can easily and rapidly clean a substrate."

Problems solved by technology

Accordingly, the whole system becomes a very large scale and complex inevitably in this case.
Further, generation of particles and (metal) contamination from various liquid-contact portion caused by complication of the substrate cleaning apparatus is in question.
In this manner, at present, it is difficult to avoid increases in scale and complication of the whole apparatus attendant upon an increase in cleaning speed of substrate cleaning apparatus.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical supply system
  • Chemical supply system
  • Chemical supply system

Examples

Experimental program
Comparison scheme
Effect test

first example

A substrate cleaning apparatus of this example is in which wafers are loaded one by one and a cleaning liquid is supplied with rotating the wafer in a circumferential direction, and a single wafer spin cleaning apparatus capable of realizing wide-ranging functions in a wet cleaning process for semiconductor wafers or the like.

FIG. 1 is a schematic sectional view showing the whole construction of the substrate cleaning apparatus of this example.

This substrate cleaning apparatus is constructed by comprising a cleaning chamber 1 in which a substrate (wafer) 11 is set and cleaning is performed, and a chemical supply system 2 for producing and supplying a cleaning liquid at a desired chemical concentration.

As shown in FIG. 2, the cleaning chamber 1 defines a closed space wherein the wafer 11 to be cleaned is received, and is provided with a gate valve 12 that is a taking in / out portion for the wafer 11. This cleaning chamber 1 is constructed by comprising a wafer set means 14 havin...

second example

Successively, the second example of the present invention will be described. In this example, like the first example, a substrate cleaning apparatus of single wafer spin cleaning type comprising a cleaning chamber and a chemical supply system, is disclosed, but it differs on the point that the construction of the chemical supply apparatus of the chemical supply system is different. The same components or the like as those of the substrate cleaning apparatus of the first example are denoted by the same references, and their explanations will be omitted.

FIG. 35 is a schematic sectional view showing the whole construction of the substrate cleaning apparatus of this example.

The substrate cleaning apparatus of this example is constructed by comprising a cleaning chamber 1 and a chemical supply system 2. Here, the chemical supply system 2 is constructed by comprising a chemical storage tank 21, a chemical supply apparatus 121 connected to the chemical storage tank 21 for positively pe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A chemical supply system comprises, as principal elements, a chemical storage tank in which a liquid chemical for cleaning is stored in the state of its formulated concentrate, a chemical supply apparatus connected to the chemical storage tank for positively performing chemical supply, a piping system connected to the chemical supply apparatus to form a supply flow passage that is a passage for ultrapure water which the liquid chemical is to be mixed with, a pair of discharge nozzles disposed at end portions of the piping system so as to oppose surfaces of a wafer set in a cleaning chamber to supply a cleaning liquid onto the surfaces. Thereby, remarkable miniaturization / simplification of a cleaning liquid supply system including chemical tanks is intended, it is made possible easily and rapidly to compound and supply a cleaning liquid at an accurate chemical concentration, and particles or the like being generated and mixing in a cleaning liquid, are suppressed to the extremity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical supply pump, a chemical supply apparatus, and a chemical supply system (a chemical supply method) for accurately supplying a desired quantity of a liquid chemical, in particular, it is suitable for applying to a substrate cleaning apparatus (a substrate cleaning method) for cleaning semiconductor wafers or the like. 2. Description of the Related Art Conventionally in a semiconductor wet process, used is a substrate cleaning apparatus for performing a process such as cleaning with a cleaning liquid of ultrapure water and a liquid chemical. As such a substrate cleaning apparatus, remarked is a substrate single wafer spin cleaning apparatus in which substrates are loaded one by one and a cleaning liquid is supplied with rotating the substrate in a circumferential direction. In a conventional substrate cleaning apparatus, it was indispensable to provide a plurality of large-sized clean...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B01F25/60H01L21/304B01J4/02F04B13/02F04B43/00F04B43/02F04B43/04F04F7/00F16K7/12G05D11/13
CPCB01F5/0471B01F5/0475B01F15/0203B01F15/024B01F15/0244B01F15/042H01L21/67051F04B43/0054F04B43/02F04B43/046F04F7/00F16K7/123G05D11/138B01F2215/0096B01F25/3142B01F25/314B01F35/712B01F35/71755B01F35/71761B01F35/8311B01F2101/58
Inventor NITTA, TAKAHISAMIKI, NOBUHIROYAMAGUCHI, YOSHIAKI
Owner SIPEC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products