This bonding
system (1) is provided with a first transfer device (61), a
surface modification device (33), a load
interlock vacuum chamber (31), a transfer chamber (32), a substrate
processing device (34), and a bonding device (41). The first conveying device conveys a first substrate (W1) and a second substrate (W2). A
surface modification device (33) modifies the surfaces of the first substrate (W1) and the second substrate (W2). A load
interlock vacuum chamber (31) switches the
atmosphere in the chamber between an atmospheric
atmosphere and a reduced-
pressure atmosphere. The transfer chamber (32) is provided with a second transfer device (32a) for transferring the first substrate (W1) and the second substrate (W2) between the load
interlock vacuum chamber (31) and the
surface modification device (33). The surface modification device (33) is provided with a first
gas supply unit (122) and a first switching unit (126). The first
gas supply unit (122) is capable of supplying a plurality of types of gases to the surface modification device (33). The first switching unit (126) switches the type of gas to be supplied to the surface modification device (33). The conveyance chamber (32) is provided with a second
gas supply unit (130) and a second switching unit (136). The second gas supply unit (130) is capable of supplying a plurality of types of gases to the transport chamber (32). The second switching unit (136) switches the type of gas supplied to the conveyance chamber (32).