Atomic layer deposition of noble metals
Patent Information
- Authority / Receiving Office
- US · United States
- Patent Type
- Applications(United States)
- Current Assignee / Owner
- SENKEVICH JOHN JOSEPH
- Publication Date
- 2006-05-04
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
RELATED APPLICATION
[0001] This application claims the benefit of U.S. Patent Application Ser. No. 60 / 418,519, filed Oct. 15, 2002.BACKGROUND OF THE INVENTION
[0002] The use of self-limiting chemical reactions to sequentially grow monolayers of transition metals will positively impact many and diverse applications. For example, among the applications for metal atomic layer deposition (ALD) are noble metal catalysts on rough electrode and mesoporous bulk materials, Cu seed layers for the electrochemical deposition and chemical vapor deposition of Cu, conformal adhesion layers to Cu metallic overlayers and alkylthiolate self-assembled monolayers. Palladium is useful as a catalyst in fuel cells and for hydrogenation reactions, gas sensors, and hydrogen permselective membranes. Palladium, like the other noble metals, is rather costly; therefore, a driving force exists to reduce the quantity used as a function of its activity. Atomic layer deposition is an ideal method for extracting the...