Multi-channel temperature control system for semiconductor processing facilities

Abstract

A temperature control system for multiple process components is a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules in fluid communications with the common cooling unit that separately control the temperature of the multiple process components. The remote temperature control modules are located near the process components and each remote temperature control module includes a circulation loop for the cooling fluid from the common cooling unit and circulation loop for a heat transfer fluid that received from a process component. A heat exchanger within the remote temperature control module allows heat transfer between the heat transfer fluid and the cooling fluid, thereby cooling the process component. A heat source may also be include within the remote temperature control module to provide heat to the heat transfer fluid and to the process component.

Description

[0001] This application is a continuation application of U.S. patent application Ser. No. 09 / 780,713 filed on Feb. 8, 2001, which is incorporated by reference, as if fully set forth herein.FIELD OF THE INVENTION [0002] The invention relates to temperature control systems for semiconductor processing facilities, and more particularly to a multi-channel temperature control system. BACKGROUND OF THE INVENTION [0003] Many semiconductor fabrication processes are temperature sensitive and therefore temperature control within process tools is important to producing high yield wafers. Typical temperature control techniques applied in semiconductor fabrication facilities involve providing a separate temperature control system for each tool that needs temperature control. For example, each temperature control system may include its own refrigeration unit, its own heat exchanger, and its own refrigerant distribution system. The one temperature control system-per-tool approach to temperature co...

AI Technical Summary

Benefits of technology

"The patent describes a temperature control system for multiple process components in a semiconductor processing facility. The system includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules that separately control the temperature of the process components. Each remote temperature control module includes a cooling fluid circulation loop, a heat transfer fluid circulation loop, a heat exchanger, a cooling fluid control valve, and temperature control logic. The cooling fluid circulation loop circulates the cooling fluid through the remote temperature control module and the heat transfer fluid is in fluid communication with the process component. The heat source is controlled by the temperature control logic in response to the temperature set point information and temperature feedback information related to the process component. The cooling unit can be located separate from the remote temperature control modules or connected to the process tools. The system allows for efficient temperature control with minimal heat transfer fluid circulation."

Problems solved by technology

One drawback to the one temperature control system-per-tool approach is that each of the individual temperature control systems includes its own, relatively small, refrigeration unit.

Smaller refrigeration units are generally less energy efficient and less reliable than larger refrigeration systems.

Another drawback to the one temperature control system-per-tool approach is that all of the separate temperature control systems take up a large amount of floor space in a fabrication facility.

Additionally, as the distance between the process tool and the evaporator / heat exchanger increases, the accuracy of temperature control is less reliable because the heat transfer fluid is subjected to different ambient temperature conditions while it is circulated between the process tool and the evaporator / heat exchanger.

Because the heated or chilled fluid is used to directly heat or cool the process tools, the range of temperature control possible at all of the process tools is limited by the temperature of the heated or chilled fluid that is circulated through the process tools and the electrical characteristics of the heated or chilled fluid must be compatible with the process tools that are being heated or cooled.

Although the two parallel fluid supply systems can provide sources of heating and cooling to the same process tool, the parallel supply system are costly.

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