Copper alloy

Abstract

A copper alloy, containing: Ni and / or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, with a balance being Cu and inevitable impurities; the copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni and / or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 μm.

Description

TECHNICAL FIELD

[0001] The present invention relates to a copper alloy applicable as materials for electric and electronic instruments. BACKGROUND ART

[0002] Heretofore, generally, in addition to iron-based materials, copper-based materials, such as phosphor bronze, red brass, and brass, which are excellent in electrical conductivity and thermal conductivity, have been used widely as materials for electric and electronic instruments (electrical and electronic machinery and tools).

[0003] Recently, demands for miniaturization, weight saving, and associated high-density packaging of parts of electric and electronic instruments have increased, and various characteristics of higher levels are required for the copper-based materials applied thereto. Examples of basic characteristics required include mechanical properties, electrical conductivity, stress relaxation resistance, bending property, and spring property. Of those, improvements in stress relaxation resistance, tensile strength, ...