Copper alloy

a technology of copper alloy and alloy material, applied in the field of copper alloy, can solve the problems of mass production of alloys, degrade the bending property of the resultant alloy material, and the characteristics cannot be satisfied with conventional commercially available, and achieve excellent bending property and stress relaxation resistance, and high levels.

Inactive Publication Date: 2008-02-28
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0030] The copper alloy of the present invention compatibly has a tensile strength and a bending property (R/t) at high levels, without impairing electrical conductivity, while stress relaxation resistance that may largely affect reliability of connectors and terminals is further improved. The copper alloy of the present invention is excellent in bending property and stress relaxation resista...

Problems solved by technology

Accordingly, conventional copper alloys are not always durable to long term uses due to increased stress loaded on the material and increased temperatures of working environments.
The required characteristics have reached a level that cannot be satisfied with conventional commercially available, mass-produced alloys, such as phosphor bronze, red brass, and brass.
The method can provide high-strength materials by employing a large cold-working ratio, but employment of a large cold-working ratio (generally 50% or more) is known to conspicuously degrade bending property of the resultant alloy material.
However, the precipitation-type alloy has such problems that the crystal grain size increases to cause giant crystal grains upon the solution treatment, and that the crystal grain size upon the solution treatment remains unchanged and becomes the crystal grain ...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0068] An alloy component containing Ni, Si, Cr, and other elements in the amounts, as shown in Table 1, with the balance being Cu and inevitable impurities, was melted with a high frequency melting furnace, and the thus-molten alloy was cast at a cooling rate from 10 to 30° C. / second, to give an ingot with a size: thickness 30 mm, width 100 mm, and length 150 mm. After holding the ingot at 900° C. for 1 hour, the resultant ingot was subjected to hot-rolling, to give a hot-rolled sheet with a sheet thickness (t) of 12 mm, each of the surfaces of the sheet was chamfered by 1 mm, to adjust the thickness (t) at 10 mm, and then the sheet was finished at a thickness (t) of 0.167 mm by cold-rolling. The sheet material was then subjected to solid solution treatment. The temperature of the solid solution treatment was selected, in accordance with the conditions described in the foregoing paragraph [0026]. For changing the size of precipitate Y1, a higher solid solution treatment temperature...

example 2

[0079] With respect to the copper alloys containing the elements in the amounts, as shown in Table 3, with the balance being made of Cu and inevitable impurities, the test was conducted in the same manner as in Example 1, except that the measurement was made on the precipitate Y2 in place of the precipitate Y1. The results are shown in Table 4. The production and measurement methods were also performed in the same manner as in Example 1.

[0080] [Table 3]

TABLE 3NiSiCoOtherClassificationNo.[mass %][mass %][mass %][mass %]Example62.330.480.09—according to73.200.670.55—this invention83.840.930.17Zn: 0.5194.291.020.14Zn: 0.49Sn: 0.15Mg: 0.12104.821.090.37Zn: 0.50Sn: 0.12Comparative1052.400.520.04—example1063.260.770.19—1073.940.860.19Zn: 0.52Sn: 0.151084.321.000.31—

[0081] [Table 4]

TABLE 4NumberCrystalGrain size ofGrain size ofof Y2 / grainBendingprecipitate Xprecipitate Y2numberdiameterTSECpropertyClassificationNo.[μm][μm]of X[μm][MPa][% IACS][R / t]Example60.0160.2093316718451.0according to...

example 3

[0083] With respect to the copper alloys containing the elements in the amounts, as shown in Table 5, with the balance being made of Cu and inevitable impurities, the test was conducted in the same manner as in Example 1, except that the measurement was made on the precipitate Y3 in place of the precipitate Y1. The results are shown in Table 6. The production and measurement methods were also performed in the same manner as in Example 1.

[0084] [Table 5]

TABLE 5NiSiZrOtherClassificationNo.[mass %][mass %][mass %][mass %]Example112.420.590.07—according to123.180.840.69—this invention133.810.790.21Zn: 0.51144.311.010.30Zn: 0.49Sn: 0.14Mg: 0.10154.771.080.36Zn: 0.50Sn: 0.13Comparative1092.300.630.06—example1103.280.830.15—1113.900.780.20Zn: 0.53Sn: 0.151124.371.080.18—

[0085] [Table 6]

TABLE 6NumberCrystalGrain size ofGrain size ofof Y3 / grainBendingprecipitate Xprecipitate Y3numberdiameterTSECpropertyClassificationNo.[μm][μm]of X[μm][MPa][% IACS][R / t]Example110.0220.2043617709451.0accordi...

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Abstract

A copper alloy, containing: Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, with a balance being Cu and inevitable impurities; the copper alloy having a precipitate X composed of Ni and Si; and a precipitate Y composed of Ni and/or Si, and at least one or more of B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, Misch metal (MM), Co, and Be, in which a grain diameter of the precipitate Y is 0.01 to 2 μm.

Description

TECHNICAL FIELD [0001] The present invention relates to a copper alloy applicable as materials for electric and electronic instruments. BACKGROUND ART [0002] Heretofore, generally, in addition to iron-based materials, copper-based materials, such as phosphor bronze, red brass, and brass, which are excellent in electrical conductivity and thermal conductivity, have been used widely as materials for electric and electronic instruments (electrical and electronic machinery and tools). [0003] Recently, demands for miniaturization, weight saving, and associated high-density packaging of parts of electric and electronic instruments have increased, and various characteristics of higher levels are required for the copper-based materials applied thereto. Examples of basic characteristics required include mechanical properties, electrical conductivity, stress relaxation resistance, bending property, and spring property. Of those, improvements in stress relaxation resistance, tensile strength, ...

Claims

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Application Information

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IPC IPC(8): C22C9/06C22C9/00
CPCC22C9/06
Inventor MIHARA, KUNITERUTANAKA, NOBUYUKIEGUCHI, TATSUHIKOHIROSE, KIYOSHIGE
Owner FURUKAWA ELECTRIC CO LTD
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