Unlock instant, AI-driven research and patent intelligence for your innovation.

High-speed router with backplane using tuned-impedance thru-holes and vias

a high-speed router and tuned-impedance through-hole technology, applied in the field of backplanes, can solve the problems of extreme performance and drive up costs, and achieve the effects of reducing complexity, shortening the length of the longest trace, and reducing the number of differential pairs

Inactive Publication Date: 2008-11-20
FORCE10
View PDF0 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The design achieves significant cost reduction while maintaining high throughput and low noise power distribution, supporting the same line, switch fabric, and RPM card types with improved signal integrity at lower speeds, making it more economical and efficient.

Problems solved by technology

While these backplanes are capable of throughputs measurable in Terabits / second and high-wattage, low-noise power distribution, the features used to obtain this extreme performance tend to drive up cost.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-speed router with backplane using tuned-impedance thru-holes and vias
  • High-speed router with backplane using tuned-impedance thru-holes and vias
  • High-speed router with backplane using tuned-impedance thru-holes and vias

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022]Several terms have been assigned particular meanings within the context of this disclosure. As used herein, high speed signaling refers to signaling on a differential signal pair at a data rate greater than about 2.5 Gbps. A high-speed signaling layer or high-speed differential trace plane contains high-speed differential signal trace pairs, but may also contain lower speed and / or single-ended traces. A core dielectric layer is one that is cured and plated prior to assembly of a circuit board. A b-stage dielectric layer is one that is cured during assembly of cores into the circuit board. Differential signaling (or balanced signaling) is a mode of signal transmission, using two conductors, in which each conductor carries a signal of equal magnitude, but opposite polarity. Single-ended signaling (or unbalanced signaling) is a mode of signal transmission where one conductor carries a signal with respect to a common ground. The impedance of a differential trace is more differenti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. Specific via designs reduce differential signal distortion due to the via pair, allowing the backplane to operate reliably at differential signal rates in excess of 3 Gigabits per second. In particular, each via passes through nonfunctional conductive pads on selected digital ground plane layers, the pads separated from the remainder of its ground plane layer by a clearance, thereby modifying the impedance of the via and reducing reflections from the stubs created by the via.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority to and is a divisional of co-owned, co-pending U.S. patent application Ser. No. 10 / 454,735, filed Jun. 3, 2003, which is incorporated herein by reference in their entirety.BACKGROUND[0002]1. Field of the Invention[0003]This invention relates generally to backplanes, and more specifically to backplane wiring systems for highly interconnected, high-speed modular digital communications systems such as routers and switches.[0004]2. Description of Related Art[0005]A backplane generally comprises a printed circuit board having a number of card connection slots or bays. Each slot or bay comprises, e.g., one or more modular signal connectors or card edge connectors, mounted on the backplane. A removable circuit board or “card” can be plugged into the connector(s) of each slot. Each removable circuit board contains drivers and receivers necessary for communication of signals across the backplane with corresponding ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): H01R12/18
CPCH05K1/0245H05K1/0251H05K1/116H05K3/429H05K2201/044H05K2201/09236H05K2201/09454H05K2201/09636H05K2201/09781
Inventor GOERGEN, JOEL R.
Owner FORCE10