Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS

a technology of electronic materials and system alloys, applied in metal/alloy conductors, conductors, single bars/rods/wires/strips, etc., can solve the problems of unfulfilled performance significant progress, and achieve the effect of improving strength and electrical conductivity

Inactive Publication Date: 2010-04-08
JX NIPPON MINING& METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0021]The present invention can provide the Corson copper alloy having significantly improved strength and electrical ...

Problems solved by technology

This means the significant progr...

Method used

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Examples

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examples

[0038]The following examples are merely illustrative for further understanding of the present invention and its advantages, and not limiting to the disclosure in any way.

[0039]The copper alloys used in Examples of the present invention are copper alloys containing various amounts of Ni, Si and Cr and further containing optional Sn, Zn, Mg, Mn, Co and Ag, as shown in Table 1. The copper alloys used in Comparative Examples are Cu—Ni—Si copper alloys having parameters out of the range of the present invention.

[0040]The copper alloys having various compositions described in Table 1 were melted in a high-frequency melting furnace at 1300° C. and each alloy was cast into an ingot having a thickness of 30 mm. Next, this ingot was heated to 1000° C., then was hot-rolled into a plate having a thickness of 10 mm, and was cooled immediately. After the plate was planed for removal of scales to a thickness of 8 mm, it was cold-rolled into a thickness of 0.2 mm. Subsequently, solution treatment w...

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Abstract

An object of the present invention is to provide a Corson alloy having significantly improved characteristics, i.e. high strength and high electrical conductivity, by enhancing the effect of addition of Cr to a Cu—Ni—Si system alloy. There is provided a copper alloy for electronic materials comprising 1.0-4.5% by mass Ni, 0.50-1.2% by mass Si, 0.003-0.3% by mass Cr wherein the weight ratio of Ni to Si satisfies the expression: 3≦Ni/Si≦5.5, and the balance being Cu and incidental impurities, wherein particles of Cr—Si compounds having a size of 0.1 μm to 5 μm are dispersed in the alloy and the dispersed particles having an atomic concentration ratio of Cr to Si of 1 to 5 and a dispersion density of no more than 1×106/mm2.

Description

FIELD OF THE INVENTION[0001]The present invention relates to precipitation hardening copper alloys, and in particular, to Cu—Ni—Si—Cr system alloys suitable for use in components for various electronic devices.BACKGROUND OF THE INVENTION[0002]Copper alloys for electronic materials used in components for various electronic devices such as lead frames, connectors, pins, terminals, relays, and switches must satisfy both high strength and high electrical conductivity (or high thermal conductivity) as basic characteristics. Recent rapid advances of high integration and reductions in size and thickness of electronic components have accelerated requirements for higher performances of copper alloys used in components for electronic devices.[0003]In recent years, in consideration of high strength and high electrical conductivity of copper alloys for electronic materials, the use of precipitation hardening copper alloys has increased, in place of traditional solid solution strengthened copper...

Claims

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Application Information

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IPC IPC(8): C22C9/06
CPCC22C9/06C22F1/00H01B1/026C22F1/08C22F1/02H01B1/02H01B5/02
Inventor ERA, NAOHIKO
Owner JX NIPPON MINING& METALS CORP
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