Porous ceramic preparation method

Inactive Publication Date: 2011-03-31
ABC TAIWAN ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Benefits of technology

[0008]It is another object of the present invention to provide a porous ceramic member preparation method, which utilizes a bonding medium to bond powdered silicon carbide for sintering into a porous ceramic member, thereby saving energy consumption and lowering porous ceramic member manufacturing cost.
[0009]It is still another object of the present invention to provide a porous ceramic member preparation method, which utilizes a resin to cover the surface of powdered silicon carbide so that the prepared material can be squeezed into a pr

Problems solved by technology

During operation of a high-speed electronic device, much waste heat is produced.
Accumulation of waste heat may cause operation instability and will shorten the working life of the electronic device.
1. Sintering powdered silicon carbide (SiC) into porous ceramics by means of utilization of property of low coefficient of molecular diffusion of powdered silicon carbide (SiC) cannot control formation of pores in the sintered ceramic material accurately. The porous ceramic member thus obtained may have a low performance when used for heat dissipation.
2. Before sintering, powdered silicon carbide (SiC) must be mixed w

Method used

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Examples

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Example

[0018]A porous ceramic member in accordance with the present invention uses silicon carbide (SiC) as a base material. During preparation, silicon carbide (SiC) powder and a resin, preferably, thermosetting resin, are prepared at a predetermined ratio and well mixed with a solvent, for example, ketone. At this time, the resin is solved by ketone into a fluid that covers the surface of powdered silicon carbide (SiC). Continuously mix the mixture until fully vaporization of the solvent, thereby obtaining a paste. The paste thus obtained is processed into grains that are then screened through a screener so that grains are selected subject a predetermined grain size. The selected grains are then put in a mold of a shape-forming machine and squeezed into a predetermined shape. The shaped material thus obtained is treated through a low-temperature heating process at a temperature about 180° C., and cured. The shaped material that has been cured is then sintered at a temperature about the m...

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PUM

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Abstract

A porous ceramic member preparation method includes the step of mixing powdered silicon carbide and a resin at a predetermined ratio with a solvent to form a paste for enabling the resin to be covered on the surface of the powdered silicon carbide and the solvent to be fully vaporized, the step of processing the paste into a predetermined shape, the step of heating the shaped material at a low heating temperature to cure the resin, and the step of sintering the shaped material into a ceramic member having pores therein.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to preparation of ceramic materials and more particularly, to a porous ceramic preparation method, which is practical for making a porous ceramic member having evenly distributed pores therein for heat dissipation application.[0003]2. Description of the Related Art[0004]Following fast development of electronic technology, small-sized electronic devices are created and widely used for different applications. During operation of a high-speed electronic device, much waste heat is produced. This waste heat must be quickly carried away, avoiding electronic ionization and thermal stress. Accumulation of waste heat may cause operation instability and will shorten the working life of the electronic device. Copper and aluminum alloy are commonly used for making heat sinks for heat dissipation. Nowadays, powdered silicon carbide (SiC) is intensively used and sintered into porous ceramics for heat dis...

Claims

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Application Information

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IPC IPC(8): B29C65/02
CPCC04B35/565C04B38/00C04B38/067
Inventor WANG, CHOU-MO
Owner ABC TAIWAN ELECTRONICS CORP
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