Porous ceramic preparation method

Abstract

A porous ceramic member preparation method includes the step of mixing powdered silicon carbide and a resin at a predetermined ratio with a solvent to form a paste for enabling the resin to be covered on the surface of the powdered silicon carbide and the solvent to be fully vaporized, the step of processing the paste into a predetermined shape, the step of heating the shaped material at a low heating temperature to cure the resin, and the step of sintering the shaped material into a ceramic member having pores therein.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to preparation of ceramic materials and more particularly, to a porous ceramic preparation method, which is practical for making a porous ceramic member having evenly distributed pores therein for heat dissipation application.[0003]2. Description of the Related Art[0004]Following fast development of electronic technology, small-sized electronic devices are created and widely used for different applications. During operation of a high-speed electronic device, much waste heat is produced. This waste heat must be quickly carried away, avoiding electronic ionization and thermal stress. Accumulation of waste heat may cause operation instability and will shorten the working life of the electronic device. Copper and aluminum alloy are commonly used for making heat sinks for heat dissipation. Nowadays, powdered silicon carbide (SiC) is intensively used and sintered into porous ceramics for heat dis...

AI Technical Summary

Benefits of technology

[0008]It is another object of the present invention to provide a porous ceramic member preparation method, which utilizes a bonding medium to bond powdered silicon carbide for sintering into a porous ceramic member, thereby saving energy consumption and lowering porous ceramic member manufacturing cost.

[0010]It is still another object of the present invention to provide a porous ceramic member preparation method, which enables the resin powdered silicon carbide mixture to be processed into grains and screened through a screener so that grains having approximately one equal size are selected and squeezed in a mold of a shape-forming machine into a predetermined shape for further sintering, assuring even distribution of pores in the finished ceramic member.

[0012]1. Mixing, where powdered silicon carbide and a bonding medium are mixed with a resin and a solvent, for enabling the resin to be covered on the surface of the powdered silicon carbide;

Problems solved by technology

During operation of a high-speed electronic device, much waste heat is produced.

Accumulation of waste heat may cause operation instability and will shorten the working life of the electronic device.

1. Sintering powdered silicon carbide (SiC) into porous ceramics by means of utilization of property of low coefficient of molecular diffusion of powdered silicon carbide (SiC) cannot control formation of pores in the sintered ceramic material accurately. The porous ceramic member thus obtained may have a low performance when used for heat dissipation.

2. Before sintering, powdered silicon carbide (SiC) must be mixed with water and a certain amount of bonding agent into a paste-like mixture. After vaporization of water content, the mixture is squeezed into a predetermined shape, and then sintered in a sintering furnace. However, silicon carbide (SiC) has a high hardness. When squeezing the mixture into a predetermined shape, the mold of the shape-forming machine is kept in direct contact with silicon carbide (SiC). Therefore, a high level of pressure is necessary to squeeze the mixture into a predetermined shape. Further, because of direction contact between the mold and silicon carbide (SiC), the mold wears quickly with use.