Chemical mechanical polishing pads having a consistent pad surface microtexture

a technology of chemical mechanical polishing and microtexture, which is applied in the direction of lapping tools, metal-working equipment, abrasive surface conditioning devices, etc., can solve the problems of limited ability to achieve a consistent microtexture of the pad surface, continuous wear of the skiver blade, and unreliable skiving process
US20180085888A1Inactive Publication Date: 2018-03-29ROHM & HAAS ELECTRONICS MATERIALS CMP HLDG INC
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
ROHM & HAAS ELECTRONICS MATERIALS CMP HLDG INC
Publication Date
2018-03-29
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides pre-conditioned chemical mechanical (CMP) polishing pads comprising a polymer, preferably, a porous polymer having a pad surface microtexture effective for polishing having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than half of the radius of curvature of the pad and extending all the way around the surface of the pad in radial symmetry around the center point of the pad wherein the resulting CMP polishing pad has a surface roughness of from 0.01 μm to 25 μm, Sq. The CMP polishing pads may be made by methods comprising grinding the surface of a CMP polishing pad with a rotary grinder to form the surface microtexture.
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Description

[0001] The present invention relates to chemical mechanical polishing (CMP) pads having a consistent pad surface microtexture. More particularly, the present invention relates to CMP polishing pads having a CMP polishing layer of one or more polymer, preferably, a porous CMP polishing layer, having a radius, and having a surface roughness of at least 0.01 μm to 25 μm, Sq, or, preferably, from 1 μm to 15 μm, Sq, and having a series of visibly intersecting arcs on the polishing layer surface and having a radius of curvature equal to or greater than half, preferably, equal to half the radius of curvature of the polishing layer.

[0002] The manufacture of polishing pads for use in chemical mechanical planarization is known to include the molding and curing of a foamed or porous polymer in a mold having the desired diameter of the final polishing pad, such as a polyurethane, followed by demolding and cutting the cured polymer in a direction parallel to the top surface of the mold to form a l...

Claims

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