Method of manufacturing droplet ejection head
a technology of droplet ejection and manufacturing method, which is applied in the field of droplet ejection head, can solve the problems difficulty in even handling orifice plate, and a tendency to decrease the rigidity of orifice plate, so as to reduce the influence of orifice plate flexure, prevent orifice plate flexure, and simple and easy structure
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embodiment 1
[0045]Embodiments of the manufacturing method according to the present invention will be described below with reference to the drawings. In the description, an ink jet head out of the liquid ejection heads is taken as an example. Firstly, FIG. 1 illustrates a plan view of an ink jet recording head chip manufactured according to Embodiment 1 of the manufacturing method of the present invention. In addition, FIG. 2 illustrates the sectional view taken along the line 2-2 of FIG. 1. In FIG. 1, a dashed line represents a portion which is not seen from the surface. In addition, a shaded portion represents a deformation induction region 20 which will be described later. In this embodiment, an example in which the deformation induction region 20 is formed in one part of the orifice plate will be described.
[0046]As is illustrated in FIG. 2, an ink jet recording head obtained according to Embodiment 1 uses a heater 7 as an energy-generating element. The heater 7 is formed on a substrate 1 of ...
embodiment 2
[0097]As Embodiment 2 of the manufacturing method according to the present invention, an example will be described below in which the deformation induction region 20 is provided in the flow channel member 3 side. FIGS. 7A, 7B, 7C, 7D and 7E illustrate a process of manufacturing a droplet ejection head of Embodiment 2. In FIG. 7A, through-holes, in other words, grooves 22 are provided in a portion in the vicinity of the outer circumferential part of an ink flow channel 9 on the face to be laminated of a flow channel member 3 on a chip substrate, in other words, in a portion in the vicinity of the outer circumferential part 8 of the flow channel member and nearer to a flow channel member side than the outer circumferential part of the ink flow channel, and the deformation induction region 20 includes the grooves 22.
[0098]The portion in the vicinity of the outer circumferential part of the liquid flow channel on the face to be laminated of the flow channel member 3 and nearer to the fl...
example
Example 1
[0114]A wiring of aluminum, an interlayer insulation film of a silicon oxide thin film, a heater thin-film pattern of tantalum nitride, and a contact pad 6 for electrically connecting the wire with an external control section were formed on a 6-inch silicon substrate by a photolithographic process. A liquid epoxy resin solution having a negative-type photosensitivity, which is a material for forming a flow channel member, was applied onto the silicon substrate which had the above components formed thereon, by a spin coating method, and the exposure and development were carried out. The thickness of the applied epoxy resin film (flow channel member 3) was 5.5 μm. The specific composition of the epoxy resin solution will be shown below.
[0115]Composition:[0116]EHPE-3150 (trade name, made by Daicel Chemical Industries, Ltd.) 100 parts by mass[0117]HFAB (trade name, made by Central Glass Co., Ltd.) 20 parts by mass[0118]A-187 (trade name, made by Nippon Unicar Company Limited) 5...
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Abstract
Description
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