Non-volatile memory with improved coupling rate and its making method

A non-volatile storage and conductive layer technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of reducing the dielectric layer, difficult charge pump design, increasing internal polysilicon, etc.

Inactive Publication Date: 2007-11-14
WINBOND ELECTRONICS CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The coupling ratio of the control gate to the floating gate is very important for non-volatile memory. A low coupling ratio requires a high control gate voltage to achieve program and erase efficiency. A high control gate voltage requirement This highlights the difficulties in the design of charge pumps. Moreover, the high control gate voltage requirements also hinder the reduction of oxide thickness and channel length of high voltage devices.
In order to counteract this shortcoming of a high voltage requirement, there are several ways to increase the coupling ratio. For example, the thickness of the dielectric layer can be reduced. Another method is to increase the dielectric constant of the inner polysilicon. However, reducing the dielectric The thickness of the layer is limited by the lifetime of the data retention, plus increasing the dielectric constant of the inner polysilicon usually requires the development of new materials

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  • Non-volatile memory with improved coupling rate and its making method
  • Non-volatile memory with improved coupling rate and its making method
  • Non-volatile memory with improved coupling rate and its making method

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Embodiment Construction

[0027] The present invention is described below with an example of a non-volatile semiconductor memory device. It should be understood, however, that the present invention is not limited to the use of a particular type of device or memory cell, and that the present invention is more broadly applicable to any semiconductor device in which internal impedance is a concern. Furthermore, while the present invention is well suited for use in non-volatile semiconductor memory devices, it also provides significant advantages in numerous other applications.

[0028] 1 to 6 show the process of forming an embodiment of the present invention, please refer to FIG. 1 and FIG. 2 (FIG. 2 is a cross-sectional view along the I'-I plane of FIG. As a starting point, a long line of an isolation region 12 is formed in the silicon substrate 10 by, for example, an area oxidation method, a first dielectric layer (for example, silicon nitride) 14 is formed on the isolation region 12 and the silicon sub...

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Abstract

By increasing the overlapping area of control grid and floating gate, a storage device attains the increase of the coupling ratio of control grid to floating gate by enlarging the capacity area. An unvolatile storage device for increasing the coupling ratio consists of a substrate with a complex number of isolation areas, a first conductive layer formed on the substrate and isolation area. A pair of sidewalls of the first conductive layer is vertically in each isolation area the said vertical sidewall is covered with curtain by a dielectric layer etched with vertical edge. A second conductive layer is formed on the first conductive layer and is isolated with the first one by an interface to increase the surface area and the coupling ratio. An internal conductive dielectric layer is formed in the middle between the first and second conductive layers.

Description

technical field [0001] The present invention relates to a non-volatile memory (Non-Volatile Memory, NVM), and in particular to a non-volatile storage device with an increased coupling ratio (Coupling Ratio), which is achieved by increasing the capacitance area, so that the The control gate voltage required for program and erase efficiency can be reduced. [0002] The invention also relates to a method of manufacturing the above device. Background technique [0003] A floating gate erasable memory cell (Erasable Memory Cell), typically includes a field effect transistor (Field Effect Transistor), a floating gate is located above the channel of the field effect transistor, and at least a part of a control gate is located on the floating above the grid. Floating gates and control gates are usually made of polysilicon. As the name of the floating gate indicates, electrons are isolated in the floating gate. For example, the floating gate can be formed in an environment complete...

Claims

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Application Information

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IPC IPC(8): H01L27/115H01L21/82H01L21/8247
Inventor 胡钧屏
Owner WINBOND ELECTRONICS CORP
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