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An optical micro-electromechanical component and a manufacturing method thereof

A technology of micro-electromechanical components and optics, applied in optical components, electrical components, optics, etc., can solve problems such as optical micro-electromechanical component circuit problems

Inactive Publication Date: 2009-03-04
WALSIN LIHWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to Si x N y is a dielectric, so the resulting optical MEMS components still have circuit problems

Method used

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  • An optical micro-electromechanical component and a manufacturing method thereof
  • An optical micro-electromechanical component and a manufacturing method thereof
  • An optical micro-electromechanical component and a manufacturing method thereof

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Embodiment Construction

[0032] The integrated manufacturing process of the present invention uses thin-film silicon as the substrate 11 and uses oxide 12 and photoresist 13 as a self-aligned etching mask (as shown in FIG. 1A ). Two trenches 14 (trench) with different depths (as shown in FIG. 1B ) are fabricated by two deep reactive ion etching (DRIE) to serve as vertical comb electrodes. Then perform thermal oxidation (thermal oxidation) to form a thermal oxide layer 15, and deposit a first polysilicon layer 16 (lstploly-Si deposition) to backfill the above-mentioned generated trenches (such as Figure 1C As shown), forming a rib reinforced structure (rib reinforced structure), thus greatly improving the rigidity of the film structure. Then, as shown in FIG. 1D, a first nitride (Si x N y ) layer 17 and a second polysilicon (2nd poly-Si) layer 18, and pattern them to form electrical connections. Then a third deep reactive ion etching (Deep ReactiveIon Etching, DRIE) is performed to remove the first...

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Abstract

The method for making optical microelectromechanical component includes the following steps: providing a substrate, depositing an oxide layer on said substrate, making multiple etching on said substrate to form trench with several depths, depositing first polycrystalline silicon layer for back-filling said trench, depositing first nitride layer and second polycrystalline silicon layer on said back-filled trench, removing said first polycrystalline silicon layer, depositing second nitride layer and making bulk etching.

Description

technical field [0001] The present invention relates to an optical micro-electromechanical element and a manufacturing method thereof, in particular to a method for manufacturing an optical micro-electromechanical element by integrating thin film manufacturing technology, bulk micro-processing technology and deep reactive ion etching. Background technique [0002] Microelectromechanical system (MEMS for short) technology combines semiconductor manufacturing technology and other micromachining methods to manufacture and integrate optical, mechanical, electrical and other components on a chip. Optical MEMS technology (Optical MEMS) is a key development area in the MEMS field, and the polysilicon MUMP manufacturing process is one of the most important platform technologies for optical MEMS components. However, the application of components with micro-machined surfaces is often limited by the rigidity of the film and the stress left on it. For example, the polysilicon film used ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/00G02B26/10B81B7/00
Inventor 吴名清林弘毅方维伦
Owner WALSIN LIHWA