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Demolding material for integrated circuit packaging

An integrated circuit and demoulding technology, which is applied in the field of demoulding materials, can solve the problems of environmental pollution and inability to achieve the best of both worlds, and achieve the effect of simple demoulding method, low cost and improved production efficiency

Active Publication Date: 2009-08-19
无锡乐东微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Before the present invention was made, in the prior art, the following methods were generally used to clean and remove scales on the surface of large-scale integrated circuit packaging molds: 1. Liquid spray was used; 2. Amino resin was the matrix resin, and inorganic mineral fine powder was the main 3. A clearing and releasing agent for auxiliary thermosetting materials with the same injection molding process as epoxy resin packaging materials. Its main components are melamine resin, fiber filler, Granular fillers, as well as some lubricants and curing agents; 4. Use melamine and conditional mixtures as cleaning and release agents; using the above method to clean the mold generally has the following problems: 1. The machine needs to be stopped when using it; 2. Due to the mold The particles repaired by the production line will cause environmental pollution; 3. The irritating odor will cause environmental pollution
When using the above materials to clean the mold, it is necessary to take into account the convenience of demoulding during reprocessing, and it is often not possible to have the best of both worlds

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The mold release material that integrated circuit packaging of the present invention is used adopts following processing steps to make:

[0015] First, take 40 parts of synthetic rubber as the adhesive, add 15 parts of natural / synthetic wax, and use it as a lubricant to reduce the adhesion of stains on the surface of the mold through penetration. Add 43 parts of silica powder as an adsorbent to adsorb the contamination that has penetrated into the surface of the cured rubber sheet. Add the curing agent organic peroxide of the rubber sheet, and the organic peroxide gets 2 parts of benzoic acid peroxide. Stir the above mixture evenly before kneading, mixing time: 30 minutes, kneading at room temperature; discharge the mixture after forming a uniform colloid; flatten the above kneaded colloid by a calender, and split into pieces to make a finished colloid strip. The finished product is packaged and put into storage.

[0016] The colloid strip release material of the pres...

Embodiment 2

[0018] The mold release material that integrated circuit packaging of the present invention is used adopts following processing steps to make:

[0019] First, take 45 parts of synthetic rubber as the adhesive, add 15 parts of natural / synthetic wax, and use it as a lubricant to reduce the adhesion of stains on the surface of the mold through penetration. Add 38 parts of silica powder as an adsorbent to adsorb the contamination that has penetrated into the surface of the cured rubber sheet. Add the curing agent organic peroxide of the rubber sheet, and the organic peroxide gets 2 parts of benzoic acid peroxide. Stir the above mixture evenly before kneading, mixing time: 40 minutes, kneading at room temperature; the mixture forms a uniform colloid and then discharges; the above kneading colloid is flattened by a calender, and the colloidal strips are released from the mold Material; the length of the colloid strip mold release material of the present invention is: 200mm; the wid...

Embodiment 3

[0021] The mold release material that integrated circuit packaging of the present invention is used adopts following processing steps to make:

[0022] First, take 47 parts of synthetic rubber as the adhesive, add 15 parts of natural / synthetic wax, and use it as a lubricant to reduce the adhesion of the stain on the surface of the mold through penetration. Add 43 parts of silica powder as an adsorbent to adsorb the contamination that has penetrated into the surface of the cured rubber sheet. Add the curing agent organic peroxide of the rubber sheet, and the organic peroxide gets 2 parts of benzoic acid peroxide. Stir the above mixture evenly before kneading, mixing time: 45 minutes, kneading at room temperature; the mixture forms a uniform colloid and then discharges; the above kneading colloid is flattened by a calender and opened to form a colloidal strip for demoulding Material; the length of the colloid strip release material of the present invention is: 190mm; the width ...

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Abstract

The present invention relates to demolding material for integrated circuit packaging, and is especially one kind of material as the supplementary material for large scale integrated circuit packaging and capable of facilitating demolding, reducing residue on the mold and maintaining mold clean. The demolding material is produced through adding wax, silica powder and organic peroxide into synthetic rubber; mixing to form homogeneous rubber material; flattening in a rolling mill; and cutting into rubber strip.

Description

technical field [0001] The invention relates to a release material for integrated circuit packaging, in particular it is a material that facilitates the detachment of the film during the packaging process of large-scale integrated circuits, reduces residues on the mold, and keeps the mold clean, and belongs to the production of large-scale integrated circuits. auxiliary materials. Background technique [0002] With the development of integrated circuits, packaging integrated circuits with epoxy resin has become the mainstream. After a certain amount of integrated circuits are packaged with epoxy resin, fouling will occur on the surface of the mold, and the surface of the product will be dark. In severe cases, the mold will stick and damage the mold. It is indispensable in the plastic packaging process to use cleaning and mold release agents for demoulding. An important step, its role to ensure normal production. It plays a role in ensuring the reliability and appearance qu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C10M107/00H01L21/56C10M103/00C10M129/22C10N40/36
Inventor 朱汪龙
Owner 无锡乐东微电子有限公司
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