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Polyimide film

A polyimide film and film technology, applied in the direction of circuit substrate materials, printed circuit components, etc., can solve the problems of low transmission efficiency of high-frequency signals, not easy to accelerate circuit operation, low response speed, etc., to achieve low loss, The effect of excellent thermal degradation stability and fast response speed

Active Publication Date: 2009-10-14
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To be precise, since the properties of the film change significantly in response to humidity, the efficiency of high-frequency signal transmission is low, and the response speed is low (the difference in the rise of the pulse signal), and it is not easy to accelerate the circuit made of polyimide film. operation and needs further improvement

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0279] (Example 1-4, Comparative Example 1-3)

preparation Embodiment -1

[0281] A reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirring bar was purged with nitrogen, and 500 parts by mass of 5-amino-2-(p-aminophenyl)benzoxazole was added thereto. Then, 9000 parts by mass of N-methyl-2-pyrrolidone was added, and after complete dissolution, 485 parts by mass of pyromellitic dianhydride was added. The mixture was stirred at 25° C. for 50 hours to obtain a brown viscous polyamic acid solution. The reduced viscosity (ηsp / C) is 4.6dl / g.

[0282]

[0283] The polyamic acid solution was coated onto a stainless steel belt (squeegee / bandgap 650 μm) and dried at 90° C. for 60 minutes. After drying, the self-supporting polyamic acid film was peeled off from the stainless steel belt to obtain a raw film with a thickness of 40 μm.

[0284] The resulting green film was passed through a nitrogen-purged continuous type heat treatment furnace, and heated in two steps under the conditions described in Table 1 to perform imidization re...

preparation Embodiment -2

[0288] Clean the reaction vessel equipped with nitrogen inlet pipe, thermometer and stirring bar with nitrogen, and 5-amino-2-(p-aminophenyl) benzoxazole (formula 1, 450 parts by mass) and 5-amino-2 -(m-aminophenyl)benzoxazole (Formula 3, 50 parts by mass) was put therein. Then, 9100 parts by mass of N,N-dimethylacetamide was added, and after complete dissolution, 485 parts by mass of pyromellitic dianhydride was added. The mixture was stirred at 25° C. for 40 hours to obtain brown viscous polyamic acid solution A. Its ηsp / C was 4.0dl / g.

[0289]

[0290] The polyamic acid solution was coated onto a stainless steel belt (squeegee / bandgap 650 μm) and dried at 90° C. for 60 minutes. After drying, the self-supporting polyamic acid film was peeled off from the stainless steel belt to obtain a raw film with a thickness of 40 μm. The amount of residual solvent in the green film was then 35% by mass.

[0291] Pass the obtained raw film through a continuous drying furnace and he...

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PUM

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Abstract

[Problem] In order to provide a polyimide film suitable for use as a base film for electronic components, excellent in heat resistance, rigidity, high-frequency characteristics and also excellent in thermal deformation stability so that even when heated When various functional layers are superimposed on it, failures caused by curling will not occur. [Means for Solving the Problem] A polyimide film having an in-plane orientation coefficient of 0.79 to 0.89 as measured by an X-ray diffraction method, the degree of in-plane orientation of one main surface of the film is the same as that of the other main surface of the film The difference in the degree of orientation is not more than 2, and wherein the degree of curl of the film is not more than 5%, which is obtained by imidizing a polyimide precursor film having a specific imidization rate.

Description

technical field [0001] The present invention relates to a polyimide film, and in particular, to a polyimide film which is preferable as a base material of electric parts for high-frequency matching and has excellent heat resistance. Background technique [0002] As materials for substrates of electrical components of information and telecommunication devices (broadcasting devices, mobile radio communications, portable telecommunication devices, etc.), radars, high-speed information processing devices, etc., ceramics have been conventionally used. Substrates made of ceramics are heat-resistant and can also be used in modern information-telecommunication devices with high-frequency signal bands (up to the GHz band). However, ceramics are not flexible and cannot be made thin, which limits its applicable fields. [0003] Accordingly, consideration has been given to the use of a film made of an organic material as a base material for electrical parts, and a film made of polyimid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08G73/22H05K1/03C08L29/04
Inventor 堤正幸前田乡司河原惠造吉田武史冈本和丈森野盛雄上村彰一永良哲庸高桥则子尾山宽子仓原俊次安井润
Owner TOYOBO CO LTD