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Method for preparing spherical glass micro-cavity used for MEMS disc type packaging

A technology of wafer-level packaging and glass micro-cavity, which is applied in the field of preparation of spherical glass micro-cavities, can solve the problems of difficult control of micro-cavity shape and size, low production efficiency, long corrosion time, etc., to achieve precise design and low cost , the effect of simple method

Active Publication Date: 2009-12-02
SOUTHEAST UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The main problem of adopting the above-mentioned second type of glass cavity encapsulation method is that the commonly used method for manufacturing Pyrex7740 glass microcavities is wet etching, and the corrosion of glass is isotropic, so it is difficult to control the shape and size of the microcavity. The time is long, so the production efficiency is low, the cost is high, and the process is relatively complicated, especially in wafer-level packaging involving mass production

Method used

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  • Method for preparing spherical glass micro-cavity used for MEMS disc type packaging
  • Method for preparing spherical glass micro-cavity used for MEMS disc type packaging

Examples

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Embodiment 1

[0021] A method for preparing a spherical glass microcavity for MEMS wafer-level packaging. The glass for micro-mechanical packaging is stacked above a mold with a through hole, and the glass for micro-mechanical packaging is melted by heating. The gas is introduced so that the glass used for micro-mechanical packaging is melted to form a spherical glass microcavity.

[0022] The scheme comprises the following steps: first, a heat-resistant mold (usually a disc or a square sheet) with a through hole is placed on the opening of a box body matched with a heat-resistant mold with a through hole, and the heat-resistant mold The material can be silicon, steel, ceramics, titanium and other materials resistant to high temperatures above 800°C-1000°C, and then apply a heat-resistant sealant on the junction of the box body and the heat-resistant mold to seal the gap between the two, heat-resistant The sealant can be silicone oil, graphite and other high-temperature sealants. There is a...

Embodiment 2

[0024]A preparation method for a spherical glass microcavity used for MEMS wafer-level packaging, comprising the steps of: first a heat-resistant mold (usually a wafer or a square sheet) that is provided with a through hole is placed on the At the opening of the box body matched with the through-hole heat-resistant mold, the heat-resistant mold material can be silicon, steel, ceramics, titanium and other materials that can withstand high temperatures above 800°C-1000°C, and then combine the box body with the heat-resistant mold Apply a heat-resistant sealant to seal the gap between the two. The heat-resistant sealant can be a high-temperature sealant such as silicone oil or graphite. There is a gap for placing the mold on the upper part of the box. The shape can be round or square. The shape is adapted to the shape of the mold material. There is a valve on the box to ventilate. When inert gas is used, the pressure of the inert gas can be controlled by a pressure gauge. Open the...

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Abstract

The invention discloses a method for preparing spherical glass microcavity for MEMS wafer-level packaging. At the opening of the box, apply heat-resistant sealant at the joint of the box and the heat-resistant mold to seal the gap between the two, open the valve of the box, and connect the inside with the inert gas to encapsulate the micromachine. The glass is placed on the heat-resistant mold with through-holes, heated to make the glass for micro-machine encapsulation in a molten state, and inert gas is introduced into the box, and the gas passes through the through-holes of the heat-resistant mold with through-holes, so that the The molten state of micromechanical encapsulation uses glass to form spherical glass microcavities. Finally, cool down to obtain spherical glass microcavities for MEMS encapsulation. The method can be directly formed, the method is simple, and the cost is low. The size of the spherical glass microcavity can be controlled by controlling the size of the via hole.

Description

technical field [0001] The invention relates to a preparation method of a micro-electromechanical system packaging structure, in particular to a preparation method of a spherical glass microcavity used for MEMS wafer-level packaging. Background technique [0002] Compared with IC packaging, the characteristics of MEMS device packaging are: how to provide mechanical protection for MEMS movable parts, and at the same time provide environmental maintenance. At present, the cost of packaging has accounted for 50% to 80% of the production cost of MEMS devices. Therefore, the application and industrialization of quite a few microelectromechanical systems (MEMS) are subject to the lag of packaging technology. The development of MEMS device wafer-level packaging technology is one of the main directions of low-cost MEMS device packaging technology. The core problem of wafer-level packaging (WLP) of MEMS devices is: how to prepare a large number of microcavity structures with control...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C3/00
Inventor 尚金堂黄庆安唐洁影柳俊文
Owner SOUTHEAST UNIV