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Laser processing for heat-sensitive mesoscale deposition

A technology of deposition and laser, applied in the direction of pretreatment surface, device for coating liquid on the surface, liquid chemical plating, etc., can solve the problems of low metal yield of precursor ink, vaporization and loss of volatile components, etc.

Active Publication Date: 2010-02-24
奥普美克设计公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the metal yield of the precursor ink is typically low, in the range of 1-10%
Ceramics are also subject to thermal damage in the form of undesirable phase transitions, which can lead to cracking or loss of material or electronic properties, vaporization of volatile components, and (for non-oxide ceramics)

Method used

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  • Laser processing for heat-sensitive mesoscale deposition
  • Laser processing for heat-sensitive mesoscale deposition
  • Laser processing for heat-sensitive mesoscale deposition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Example 1: Laser Treatment of Molecular Chemical Precursors

[0065] In the case of liquid precursor based materials, laser treatment is used to raise the temperature of the deposit to its decomposition or solidification temperature. In this treatment, due to the input of laser energy, chemical decomposition or crosslinking occurs so that the precursor changes its molecular state. This change in molecular state results in the transformation of the precursor material into the desired material. Typically, the decomposition process is also accompanied by the evolution of gaseous by-products. Laser processing of precursor deposits on a variety of targets can be performed without damage to the target occurring.

Embodiment 2

[0066] Example 2: Laser sintering of particle suspensions and commercial pastes and inks

[0067] The invention also enables laser sintering of particle suspensions on thermally sensitive targets. During sintering, a solid, bound mass is formed without melting the individual particles. m 3 D. TM The process enables selective sintering of bicomponent pastes composed of low- and high-melting temperature particles such as low-melting glass and metals, dielectric, resistive materials or ferromagnetic materials.

[0068] Laser processing can be used to sinter commercial resistor and conductor pastes, and can also be used to sinter pastes for other electronic materials such as dielectrics and ferromagnets. Preferably, in M 3 D. TM During deposition, a commercial paste with a viscosity typically of 100,000 centipoise or greater is diluted in a suitable solvent and pneumatically atomized for deposition. m 3 D. TM Laser sintering of deposited commercial inks can also be done ...

Embodiment 3

[0069] Example 3: M 3 D TM -Laser sintering of deposited nanoparticle ink

[0070] m 3 D. TM -Laser sintering of deposited nanoparticle inks has also been used to form metal lines on thermally sensitive targets. The resistivity of the laser sintered nanoparticle deposit is preferably close to that of the bulk metal. m 3 D. TM - Laser sintering of deposited nanoparticles with near volume resistivity can be achieved with 100 mW or less visible or UV laser irradiation. Given that the absorption of the ink is tailored to the wavelength of the laser, infrared laser irradiation can also be used for laser sintering of nanoparticles.

[0071] The nanoparticle ink is preferably deposited in fluid form so as to maintain a suspension of the particles, and then the laser is preferably scanned over the deposit to sinter the individual particles. Simultaneous deposition and sintering of nanoparticle inks can be performed to deposit lines with greater line thickness than can b...

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Abstract

Methods and apparatus for Maskless Mesoscale Material Deposition (M<3>D<TM>) processes are taught, using an ultrasonic transducer or pneumatic nebulizer (22) to produce an aerosol with a stream thereof directed at a substrate via inlet (20), optionally passing through virtual impactor (24) to reduce gas volume or bypass to flowhead (12) through heater assembly (16), which may remove solvent or modify viscosity. Material shutter assembly (26) with mechanical shutter (28) are provided at the flowhead, and a sheath gas enters through inlet (18) to surround aerosol before exiting from the flowhead, which is used for deposition on a substrate where it is treated with a beam from laser module (10), to cause heating at or above the substrate's damage threshold.

Description

[0001] Cross References to Related Applications [0002] This application claims U.S. Provisional Patent Application Serial No. 60 / 506,495, filed September 26, 2003, entitled "Laser Treatment Process for Low-Temperature Deposition," and Serial No. 60 / 508,759, filed October 3, 2003 , an interest in the filing of a US Provisional Patent Application entitled "Method for Fabricating Resistive Structures". This application is also a continuation-in-part of U.S. Patent Application Serial No. 10 / 746,646, filed December 23, 2003, entitled "Apparatuses, Methods, and Precision Spray Processes for Direct Write and Maskless Mesoscale Material Deposition," This patent application is in turn a continuation-in-part of U.S. Patent Application Serial No. 09 / 844,666, filed April 27, 2001, entitled "Precision Spray Processes for Direct Write Electronic Components" (which was filed on May 5, 1999 Serial No. 09 / 305,985, titled "Precision Spray Processes for DirectWrite Electronic Components", filed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05D1/02B05D1/12B05D1/40B05D3/00B05D3/06B05D5/12B05D7/02C08J7/04C08J7/18C08F2/46C23C18/00
Inventor M·J·雷恩B·H·金M·埃辛M·G·吉瑞德哈兰沈吉城
Owner 奥普美克设计公司