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Electroconductive paste composition and printed wiring board

A conductive paste and composition technology, applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problem of increasing the number of repeated printing, not being able to obtain bump height, not being able to obtain bump height that can penetrate the insulating layer, etc. Problems, achieve the effect of improving productivity and reducing the number of repeated printing

Inactive Publication Date: 2007-10-03
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] When the electrode bumps are formed by the method described in JP-A-6-350258, when using the conductive paste compositions disclosed in JP-A-2002-270033 and JP-A-2003-77337, when When applying the conductive paste composition once, the height of the bump that can penetrate the insulating layer cannot be obtained, so it is necessary to apply the conductive paste composition multiple times and perform repeated printing
In particular, in order to prevent breakage and chipping of the bumps when penetrating the insulating layer or when applying pressure, a paste that does not make the shape of the bumps too sharp is used, so the height of the bumps is often not obtained, and the number of repeated printings increases.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0059] Phenolic resin, melamine resin, silver powder, extender pigment (fine silicon dioxide), bump forming auxiliary agent and solvent are mixed according to the weight ratio described in Table 1, and fully kneaded using triple rollers to produce the present invention. Conductive paste composition. The viscosity and thixotropic index of the conductive paste composition are listed in Table 1.

[0060] Screen (stencil) printing was performed using this conductive paste. Specifically, using an aluminum metal mask with a Φ220 μm hole, using a squeegee made of polyurethane resin with a hardness of 70°, and keeping the gap between the screen plate and the substrate at 2 mm, the atmosphere conditions are controlled so that the temperature is 20° C., The printing was performed while the humidity was 50%, and bumps were formed.

[0061] The height and shape of the formed bumps were evaluated. The results are described in Table 1.

[0062] Example 1

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PUM

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Abstract

There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps having satisfactory height even by a smaller number of times of coating than that in the prior art technique. The electroconductive paste composition comprises a phenolic resin, a melamine resin, an electroconductive powder, a solvent, and a bump forming aid comprising a monohydric alcohol having a terminal methoxy group and having at least one ether bond. The electroconductive paste composition can be used in a printed wiring board.

Description

technical field [0001] The present invention relates to a novel conductive paste composition and printed circuit board. In particular, the present invention relates to a conductive paste composition particularly suitable for forming electrode bumps used for interlayer connection of a multilayer printed wiring board, and a printed wiring board using the composition. Background technique [0002] Conventionally, conductive paste compositions have been used in many applications such as IC circuits, conductive adhesives, and electromagnetic wave shielding in the field of electronics. In particular, the following method of manufacturing a printed circuit board has recently been proposed, that is, a first substrate having a conical conductive bump made of a conductive paste is provided at a set position on at least one side, and a first substrate having a conical conductive bump made of a conductive paste is provided on at least one side. The second substrate with the wiring patt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/20H05K1/09
CPCH05K1/095H05K3/4069H05K3/4614H05K2201/0367H01B1/12
Inventor 内海勉长岛正幸小林胜白金弘之
Owner DAI NIPPON PRINTING CO LTD
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