Magnetron sputtering coating method under multi-stage acceleration mode

Abstract

The present invention discloses a magnetron sputtering coating method in a multi-level acceleration mode. A two-stage acceleration electric field is set between the target material and the matrix material during a coating procedure, wherein the direction of the electric field accords with the direction of particle acceleration. The two-stage acceleration electric field is equipped with a direct-current power supply which positive pole and negative pole are connected respectively to the matrix material and the target material. Said technological process in accordance with the present invention is simple, and the operations and applications are convenient, and then the sputtering coating quality is high. A certain accelerate electric potential is applied between the target material and matrix material for magnetron sputtering to accelerate ions formed after electric dissociation and to improve gas inonization rate. At the same time, the charge energy particles sputtering out are accelerated secondarily to improve the energy of charge energy particles for bombardment to the matrix material, and then the bond strength of the film membrane and the matrix material is improved.

Description

technical field [0001] The invention relates to the improvement and optimization of a magnetron sputtering coating process, and belongs to the technical field of physical vapor deposition. Background technique [0002] The existing magnetron sputtering coating method mainly adopts high-energy particles (mostly positive ions accelerated by an electric field) to hit the surface of a solid target, and exchanges energy or momentum with the atoms or molecules on the solid surface. The sputtered atoms or molecules are deposited on the surface of the substrate or workpiece under the action of a magnetic field to form a thin film, which is called magnetron sputtering sputtering coating method. [0003] For example, the DHK-500 coating device (manufactured by Beiyi Group) is used for coating. During the normal coating process, between the target and the workpiece, the energy of the charged particles bombarding the target under the acceleration of the electric field is very small, res...

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Problems solved by technology

[0003] For example, the DHK-500 coating device (manufactured by Beiyi Group) is used for coating. During the normal coating process, between the target and the workpiece, the energy of the charged particles bombarding the target under the acceleration of the electric field is very small, resulting in a very low gas ionization rate. Moreover, the energetic particles sputtered from the surface of the solid target undergo spiral motion in the magnetic field, and the energy deposited on the surface of the substrate material is also limited, resulting in a very low bonding strength between the film and the surface of the substrate material.

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