Copper-coating compound powder and method for making the same

A composite powder, copper-clad technology, applied in the directions of lubricating composition, liquid chemical plating, superimposed layer plating, etc. High cost, low service life and other problems, to achieve the effect of good friction reduction, high temperature strength and wear resistance, long service life

Active Publication Date: 2008-02-27
CENT SOUTH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Copper-coated composite powder can be prepared by electroless plating. The preparation method reported in China is relatively expensive, because the preparation process includes pretreatment processes such as activation, sensitization, hydrophilization, and roughening of the plating substrate, which require expensive PaCl or AgNO 3 and other reagents
At the same time, the addition of a large number of complexing agents during electroless plating also makes the preparation cost of copper-coated composite powders high, which makes it extremely rare to apply electroless copper-coated composite powders in the domestic powder metallurgy industry.
[0004] In addition, ordinary copper-based composite powder materials do not contain lubricating phases and wear-resistant phases at the same time, which greatly affects the anti-friction properties, high-temperature strength and wear resistance of the products, and the service life is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Cu-70%MoS 2 (or WS 2 , or Al 2 o 3 , or SiC) coated composite powder.

[0024] Pretreatment of MoS 2 Powder (or WS 2 Powder, or Al 2 o 3 powder, or SiC powder) 35g. MoS 2 The powder is evenly mixed with 210mL of alcohol, and after it is activated and dispersed, it will be used as the substrate for plating. Preprocessed MoS 2 Powder (or WS 2 Powder, or Al 2 o 3 powder, or SiC powder) was dispersed in 1000mL electroless copper plating solution, and then copper coating was carried out. The concentration or weight of each component in the electroless copper plating solution is: copper sulfate pentahydrate (CuSO 4 ·5H 2 O): 59 g / l; Reduced iron powder (Fe): 13.15 g. Heat the plating solution, stir evenly, and control the temperature to maintain at 90°C. After the coating experiment was completed, 0.05 g of benzotriazole was added to the solution of the copper plating layer and stirred evenly. Finally, the coating powder and the solution were separated and f...

Embodiment 2

[0026] Cu-39%MoS 2 -1% Al 2 o 3 Coated composite powder.

[0027] Pretreatment of MoS 2 Powder 9.75g and Al 2 o 3 Powder 0.25g. MoS 2 and Al 2 o 3 The mixed powder is evenly mixed with 60mL of alcohol, and after it is activated and dispersed, it is used as the substrate for plating. Preprocessed MoS 2 and Al 2 o 3 The mixed powder was dispersed in 1000mL plating solution, and then copper coating was carried out. The concentration or weight of each component in the plating solution is: copper sulfate pentahydrate (CuSO 4 ·5H 2 O): 59 g / l; Reduced iron powder (Fe): 13.15 g. Heat the plating solution, stir evenly, and control the temperature to maintain at 80°C. After the coating experiment was completed, 0.002 g of benzotriazole was added to the solution of the copper plating layer and stirred evenly. Finally, the coating powder and the solution were separated and filtered, washed with clean water, and dried in a vacuum oven at 90° C. for 1 hour. Preparation of...

Embodiment 3

[0029] Cu-15%WS 2 -15% SiC coated composite powder.

[0030] Preprocessing WS 2 Powder 3.75g and SiC powder 3.75g. Will WS 2 Mix the powder with SiC and 30mL of alcohol evenly, and after it is activated and dispersed, it will be used as the substrate for plating. Preprocessed MoS 2 and Al 2 o 3 The mixed powder was dispersed in 1200mL plating solution, and then copper coating was carried out. The weight of each component in the plating solution is: copper sulfate pentahydrate (CuSO 4 ·5H 2 O): 69g; reduced iron powder (Fe): 15.3g. Heat the plating solution, stir evenly, and control the temperature to maintain at 90°C. After the coating experiment is completed, 0.0125 g of benzotriazole is added to the solution of the copper plating layer and stirred evenly. Finally, the coating powder and the solution were separated and filtered, washed with clean water, and dried in a vacuum oven at 80° C. for 1.2 hours. Prepared Cu-15%WS 2 -15% SiC coated composite powder. Coat...

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PUM

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Abstract

The present invention discloses a composite powder covered with copper and its preparation method. The composite powder covered with copper is made up by using copperplating superfine powder to completely and uniformly cover lubricating phase or abrasion-resistant phase or lubricating phase and abrasion-resistant phase mixed powder. The above-mentioned lubricating phase powder is MoS2 and WS2, and the described abrasion-resistant phase powder is Al203 and SiC.

Description

technical field [0001] The invention relates to a copper-coated composite powder, and also relates to a preparation method of the copper-coated composite powder. Background technique [0002] Copper-coated composite powder is the raw material for manufacturing copper-based composite materials and their parts. Copper-based composite materials have become a high-speed auto- Important materials for lubricating oil bearings, gears and sliding parts, as well as brushes and electrical contacts, have extensive market demand in aerospace, machinery, automobiles, electrical appliances and other industries. [0003] Copper-coated composite powder can be prepared by electroless plating. The preparation method reported in China is relatively expensive, because the preparation process includes pretreatment processes such as activation, sensitization, hydrophilization, and roughening of the plating substrate, which require expensive PaCl or AgNO 3 and other reagents. At the same time, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C23C28/00C23C18/40C23C22/05C10M103/04
Inventor 刘沙徐尔森
Owner CENT SOUTH UNIV
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