Copper etching liquid composition and production method thereof

A composition and etching solution technology, applied in the field of etching solution composition, can solve the problems of environmental pollution, slow speed, poor stability, etc., and achieve the effects of avoiding environmental pollution, reducing production costs, and high stability

Inactive Publication Date: 2008-03-12
珠海顺泽科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, in the field of PCB manufacturing, due to the finer and finer printed circuit boards, in the etching system, especially the etching system using acidic copper chloride, most of the etching solutions currently used, such as hydrogen peroxide, have the danger of explosion. Hydrochloric acid will produce a large amount of acid gas, ferric chloride will cause environmental pollution, and these etching solutions are generally not convenient to use, poor stability, large side erosion of printed circuit boards, slow speed, high cost, and serious environmental pollution

Method used

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  • Copper etching liquid composition and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] 6 kg of ammonium chloride, 0.7 kg of sodium chlorate, 35 kg of hydrochloric acid, and 58.3 kg of water.

Embodiment 2

[0032] 7 kg of ammonium chloride, 0.8 kg of sodium chlorate, 36 kg of hydrochloric acid, and 56.2 kg of water.

Embodiment 3

[0034] 8 kg of ammonium chloride, 0.9 kg of sodium chlorate, 37 kg of hydrochloric acid, and 54.1 kg of water.

[0035] Three. the preparation method of described copper etchant composition:

[0036] At normal temperature and pressure

[0037] 1. Add raw materials ammonium chloride, sodium chlorate, hydrochloric acid and water in sequence in proportion to the production tank;

[0038] 2. Stir until completely dissolved.

[0039] Four. the mode of operation in production of described copper etchant composition:

[0040] Controls can be added manually or automatically, preferably using automatic control.

[0041] (1). Automatically add control production line:

[0042] 1. Clean the etching machine first, and add the copper etching solution into the stock solution tank;

[0043] 2. Perform controller setting (regenerative system setting)

[0044] Its specific gravity is 1.20-1.25, HCl is 2.60-2.70, close the H 2 o 2 , the temperature is 48℃~52℃;

[0045] 3. Etching opera...

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PUM

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Abstract

The invention discloses an acidic copper-eroding fluid combination for eroding copper or copper alloy on surfaces of printed circuit boards and a production method for the fluid combination. The fluid combination comprises by weight the following: ammonium chloride 6-8%, sodium chloride 0.7-0.9%, sulfuric acid 35-37%, and the remainder water. The method for producing the copper-eroding fluid combination comprises: (1) adding by proportion in sequence the raw materials ammonium chloride, sodium chloride, sulfuric acid and water in a production tank, (2) agitating to completely solve, then inspecting. The copper-eroding fluid is a standalone fluid, can be used without changing prior production system, is of high steadiness, low erosion on the sides of base boards and high eroding speed, can reduce production cost and avoid environmental pollution.

Description

technical field [0001] The invention relates to an etching solution composition for etching copper or copper alloys, more precisely an acidic copper etching solution composition for etching copper or copper alloys on the surface of printed circuit boards and a production method thereof. Background technique [0002] At present, in the field of PCB manufacturing, due to the finer and finer printed circuit boards, in the etching system, especially the etching system using acidic copper chloride, most of the etching solutions currently used, such as hydrogen peroxide, have the danger of explosion. Hydrochloric acid will produce a large amount of acid gas, ferric chloride will cause environmental pollution, and these etching solutions are generally not convenient to use, poor stability, large side erosion of printed circuit boards, slow speed, high cost, and serious environmental pollution . Contents of the invention [0003] The purpose of the present invention is to overcom...

Claims

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Application Information

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IPC IPC(8): C23F1/18
Inventor 胡先萍
Owner 珠海顺泽科技股份有限公司
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