Method for preparing flexible winding absorbing membrane material

A wave-absorbing film, flexible technology, applied in metal material coating process, ion implantation plating, coating, etc., can solve the problem of not meeting the needs of the rapid development of electronic products and military equipment industry, consuming a lot of manpower and material resources, and increasing military expenses Expenditure and other issues, to achieve the effect of preventing harassment and injury, cost-free pollution, and fast film formation

Inactive Publication Date: 2008-03-12
夏芝林
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The wave-absorbing materials produced by the above measures are not only expensive but also inconvenient to use. For example, the wave-absorbing coatings used on warships are often washed by sea water and need to be repaired and painted frequently, which also consumes a lot of manpower and material resources. increased military spending
[0003] To sum up, the original technology can no longer meet the needs of the rapid development of the current electronic products and military equipment industry

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The preparation method steps of wave-absorbing film material are as follows:

[0027] (1) Substrate: polyethylene naphthalate film. Thickness 0.050mm, width 1100mm. (2) Vacuum plating of NiCo alloy ions. Clean and decontaminate the above-mentioned substrates, and after roughening, the packages are neatly placed in a vacuum chamber for vacuum sputtering. Its technical parameters are as follows: when the target (plate) is 80mm away from the surface of the substrate, the instantaneous temperature of the substrate surface is 258°C, the cathode voltage is 380v, the working current is 5A, the argon pressure is 0.05MPa, and the vacuum degree during operation is 2.1×10 -1 Pa, substrate moving speed 1.30m / min, NiCo alloy ion sputtering density 0.7g / m 2 , the surface resistance of the substrate is 50-1250□ / sq, and the thickness of the NiCo alloy is 50-70nm.

[0028] (3) Copper plating on the sputtered NiCo alloy surface again;

[0029] Using the pyrophosphate copper plating ...

Embodiment 2

[0036] Plating NiCo-Cu-NiCo on polyester fabric, step is as embodiment 1, difference is that substrate is polyester fabric, substrate thickness 0.080mm.

Embodiment 3

[0038] NiCo-Cu plating on polyimide film. The steps are as in Example 1, the difference is that the substrate is a polyimide film, the outermost layer is copper-plated, and the thickness of the substrate is 0.025mm

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PUM

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Abstract

The invention provides a preparing method for a flexible and windable wave-absorbing film material, which pertains to the technical field of basic materials for electrons, and is for depositing metallic ions and alloys that are wave absorbing and conductive on surfaces of flexible and windable organic insulators so as to form the wave-absorbing film. The procedures are: selecting a substrate, pre treating before sputtering, making NiCo alloy target, vacuum sputtering, plating copper on the substrate plated with NiCo alloy film, plating NiCo alloy or Ni or Co on above copper plating base, finally cutting and packing. The wave-absorbing material produced by the method is of a high film-forming speed, low cost and good wave-absorbing function. The film is thin, level and clean, of good magnetism conductivity, easy to construct and widely applicable, can be used as pasted films for secret rooms, ship decks, concealed military facility, precision instruments, flexible printed circuit boards and protecting articles, etc.

Description

Technical field: [0001] The invention relates to a method for depositing metal ions and alloys with wave-absorbing and conducting functions on the surface of a flexible and windable organic insulator to form a wave-absorbing film, which belongs to the technical field of electronic basic materials. technical background: [0002] With the development of science and technology, the damage of electromagnetic waves to electronic equipment and the impact on the surrounding environment is increasing day by day, especially electronic products are becoming more and more miniaturized, the resulting electromagnetic interference will damage itself and the surrounding equipment and The harassment and harm of personnel cannot be underestimated. For example, in a hospital, the diagnostic signal may be distorted due to electromagnetic interference, resulting in misdiagnosis; in war, if a fighter plane is subjected to electromagnetic interference, errors may occur in the locked target, and t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F17/00C23C14/34C23C14/02C23C14/20C23C14/54C25D3/38C25D3/12
Inventor 夏芝林李金明夏龙泉
Owner 夏芝林
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