Method for preparing flexible winding absorbing membrane material
A wave-absorbing film, flexible technology, applied in metal material coating process, ion implantation plating, coating, etc., can solve the problem of not meeting the needs of the rapid development of electronic products and military equipment industry, consuming a lot of manpower and material resources, and increasing military expenses Expenditure and other issues, to achieve the effect of preventing harassment and injury, cost-free pollution, and fast film formation
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Embodiment 1
[0026] The preparation method steps of wave-absorbing film material are as follows:
[0027] (1) Substrate: polyethylene naphthalate film. Thickness 0.050mm, width 1100mm. (2) Vacuum plating of NiCo alloy ions. Clean and decontaminate the above-mentioned substrates, and after roughening, the packages are neatly placed in a vacuum chamber for vacuum sputtering. Its technical parameters are as follows: when the target (plate) is 80mm away from the surface of the substrate, the instantaneous temperature of the substrate surface is 258°C, the cathode voltage is 380v, the working current is 5A, the argon pressure is 0.05MPa, and the vacuum degree during operation is 2.1×10 -1 Pa, substrate moving speed 1.30m / min, NiCo alloy ion sputtering density 0.7g / m 2 , the surface resistance of the substrate is 50-1250□ / sq, and the thickness of the NiCo alloy is 50-70nm.
[0028] (3) Copper plating on the sputtered NiCo alloy surface again;
[0029] Using the pyrophosphate copper plating ...
Embodiment 2
[0036] Plating NiCo-Cu-NiCo on polyester fabric, step is as embodiment 1, difference is that substrate is polyester fabric, substrate thickness 0.080mm.
Embodiment 3
[0038] NiCo-Cu plating on polyimide film. The steps are as in Example 1, the difference is that the substrate is a polyimide film, the outermost layer is copper-plated, and the thickness of the substrate is 0.025mm
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