Leadless soft soldering material and manufacturing method
A soft soldering and silver material technology, applied in the field of lead-free solder and its preparation, can solve the problems of endangering human and animal health, lead seeping into the ground, lead poisoning, etc., and achieves simple and easy preparation method, reduced oxygen content, Effects of performance and environmental improvement
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0014] Add 90Kg of refined tin into a graphite crucible for melting, then heat up to 1100°C, add 10Kg of refined copper, stir evenly with a wooden stirring rod to melt into a liquid tin-copper alloy, leave it for 30 minutes to cast into a tin-copper alloy ingot and take it out;
[0015] Put 90Kg refined tin into the graphite crucible and heat it up to more than 960°C after melting, put in 10Kg pure silver material, wait for the silver material to melt, let it stand for 30 minutes, cast it into a tin-silver alloy ingot and take it out;
[0016] Then put 99Kg of refined tin into the graphite crucible to melt and heat up to 600-1000°C, put in a covering agent to isolate the surface of the tin liquid from oxygen in the air (the covering agent does not participate in the reaction), put in 1Kg of pure selenium, and wait for the selenium to melt. Place it for 30 minutes and cast it into tin-selenium ingot and take it out;
[0017] The three kinds of alloy ingots prepared above (refer...
Embodiment 2
[0019] Get the three kinds of alloy ingots prepared in Example 1, Ga, Cu and tin, and prepare them by weight percentage: selenium: 0.05%, copper: 0.8%, silver: 0.5%, Ga: 0.001% and the balance is tin-free lead solder.
Embodiment 3
[0021] Take the three alloy ingots prepared in Example 1, Cu and tin, and prepare by weight percentage: selenium: 0.01%, copper: 1.0%, silver: 0.3% and the balance is lead-free solder of tin.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com