Leadless soft soldering material and manufacturing method

A soft soldering and silver material technology, applied in the field of lead-free solder and its preparation, can solve the problems of endangering human and animal health, lead seeping into the ground, lead poisoning, etc., and achieves simple and easy preparation method, reduced oxygen content, Effects of performance and environmental improvement

Inactive Publication Date: 2008-03-19
昆山成利焊锡制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In recent years, with the rapid development of electronic products and the enhancement of human awareness of environmental protection, although traditional leaded solder has the advantages of excellent wettability, solderability, good mechanical properties and low price, the heavy metal lead in leaded solder After PCB is soldered, it will be scattered in the environment along with discarded electronic products. After lo

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0013] Example 1:

[0014] Put 90Kg of refined tin into a graphite crucible to melt and then heat it to 1100°C, add 10Kg of refined copper, stir evenly with a wooden stirring rod and smelt it into a liquid tin-copper alloy, let it sit for 30 minutes and cast it into a tin-copper alloy ingot and take it out;

[0015] Then put 90Kg of refined tin into the graphite crucible and melt it to a temperature greater than 960°C, put in 10Kg of pure silver material, wait for the silver material to melt, let it stand for 30 minutes, then cast it into a tin-silver alloy ingot and take it out;

[0016] Then put 99Kg of refined tin into the graphite crucible and melt it and heat it to 600℃~1000℃. Put in the covering agent to isolate the surface of the tin from oxygen in the air (the covering agent does not participate in the reaction), put in 1Kg of pure selenium, and wait until the selenium is melted. After 30 minutes, cast into tin-selenium ingot and take it out;

[0017] The three alloy ingot...

Example Embodiment

[0018] Example 2:

[0019] Take the three alloy ingots, Ga, Cu, and tin prepared in Example 1, and prepare them by weight percentage: selenium: 0.05%, copper: 0.8%, silver: 0.5%, Ga: 0.001%, and the balance is tin-free Lead solder.

Example Embodiment

[0020] Example 3:

[0021] Three alloy ingots, Cu and tin prepared in Example 1 were prepared according to weight percentages: selenium: 0.01%, copper: 1.0%, silver: 0.3%, and a lead-free solder with the balance being tin.

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PUM

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Abstract

The invention discloses a lead-free soft soldering. Calculated by weight percentage, the lead-free soft soldering consists of following compositions: 0.1 to 3.9 per cent of Al, 0.0001 to 0.5 per cent of Se and rest of Sn. The method of manufacturing the invention is: (a) after refined tin is added into a plumbago pot to be melted, temperature rises to 1100 DEG C. refined copper is added and evenly mixed. The refined tin and the refined copper are melted to be liquid tin copper alloy. The liquid tin and copper alloy becomes the alloy ingot of tin and copper after standing for 30 minutes; (b) the refined Ag is added and melted again and the temperature rises to above 1600 DEG C. Pure nickel is added and melted. The liquid Ag and nickel becomes the alloy ingot of Ag and selenium after standing for 30 minutes; (c) with the refined tin added into and melted and the temperature rising to above 600 to 1000 DEG C, covering agent is added to isolate the liquid level of tin from oxygen in the air. Pure selenium is added and melted. The liquid tin and selenium becomes the alloy ingot of tin and selenium after standing for 30 minutes; (d) three gold ingots, Ga or Cu and the rest of tin and put into a stainless steel kettle to be melted according to the required formulation, which can be made into a tin wire, a tin bar and a tin ball.

Description

technical field [0001] The invention relates to a lead-free solder and a preparation method thereof, belonging to soldering materials. Background technique [0002] In recent years, with the rapid development of electronic products and the enhancement of human awareness of environmental protection, although traditional leaded solder has the advantages of excellent wettability, solderability, good mechanical properties and low price, the heavy metal lead in leaded solder After PCB is soldered, it will be scattered in the environment along with discarded electronic products. After long-term corrosion by acid rain, lead will seep into the ground and dissolve into the groundwater system. After drinking, it will accumulate in the body of humans or animals for a long time, which will cause lead poisoning and harm It affects the health of people and animals, and because people realize the importance of protecting the environment, environmental laws and regulations are becoming more...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/02
Inventor 苏明斌严孝钏何繁丽苏传港苏传猛
Owner 昆山成利焊锡制造有限公司
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