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Method and device for separating products with a controlled cut edge, and separated product

A technology for cutting edges and products, applied in the direction of welding/cutting auxiliary equipment, welding equipment, welding equipment, etc., can solve the problem that the cutting edge is not vertical

Inactive Publication Date: 2011-01-12
BESI NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of laser cutting is that the edges (cut edges) produced by laser cutting have a certain surface roughness, which is unacceptable in all cases
In addition, the cut is often more or less tapered, so the cut edge is often not perpendicular to the bottom or top surface of the product; this is also unsatisfactory

Method used

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  • Method and device for separating products with a controlled cut edge, and separated product
  • Method and device for separating products with a controlled cut edge, and separated product
  • Method and device for separating products with a controlled cut edge, and separated product

Examples

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Embodiment Construction

[0021] FIG. 1A shows an assembled product 1 comprising a carrier 2 on which electronic components (not shown) encapsulated by a mold 3 are placed. Figure 1B shows an arrangement of cuts 4 according to a first laser beam (not shown) arrangement, in which there are two product parts 5,6. The cutouts 4 are connected by cutting edges 7 and 8 which have a rather rough surface. Once these cutting edges 7 and 8 are processed by the second laser beam, smooth cutting edges 9 and 10 (see FIG. 1C ) are produced which have less surface area than the original cutting edges 7 and 8 produced using the first laser beam. roughness.

[0022] FIG. 2A shows a cut edge 20 of only partly shown product 21 , the surface of which has irregularities 22 . During the separation process, ie during the production of the cutting edge 20 , the first laser beam 23 is located away from the cutting edge 20 . As shown in FIG. 2B , a second laser beam 24 is placed close to the product 21 during subsequent proc...

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PUM

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Abstract

The invention relates to a method for separating products, in particular semiconductor circuits, from a shared carrier by means of laser cutting. The invention also relates to a device for applying this method. The invention further also relates to a product, in particular a semiconductor mounted on a carrier, separated by means of a laser beam using such a method.

Description

technical field [0001] The invention relates to a method of separating products, in particular semiconductor circuit products from a shared carrier by means of laser cutting, wherein the cuts are made by a first laser beam. The invention also relates to a device for separating products, in particular semiconductor circuits, from a common carrier by means of laser cutting, comprising a laser source and a product carrier movable relative to the laser source, wherein the laser A source is used to generate a first laser beam to make cuts between products. The invention further relates to a product, in particular to separate semiconductors mounted on a carrier using the laser beam method of the invention. Background technique [0002] Laser cutting products is a technology for separating small products such as electronic devices. Laser cutting is superior to conventional techniques for separating products such as sawing with a rotary saw in that it requires no or very little pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/304B23K26/06B23K26/40H01L21/78
CPCB23K26/0075B23K2201/40B23K37/08B23K26/38H01L21/78B23K26/3576B23K2101/40B23K26/062H01L21/304
Inventor H·J·范埃格蒙德J·L·J·齐芝洛
Owner BESI NETHERLANDS BV