Method for manufacturing metal binder cubic boron nitride grinding wheel with self-lubricating function
A cubic boron nitride and metal bond technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as difficulty and practicality, reduce grinding heat generation, promote grinding potential, and reduce grinding temperature. Effect
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Embodiment 1
[0015] The Ti-containing alloy is a Cu-Sn-Ti alloy with a Ti content of 10% and a mass ratio of Cu and Sn of 2:1. The HBN particle diameter is 10 microns, and its mass accounts for 5% of the total mass of the binder layer material. The bond layer material (the mixture of Cu-Sn-Ti alloy and HBN particles) was mechanically stirred for 10 minutes, and then the grinding wheel blank was made in the order of grinding wheel metal matrix / bond layer material / cubic boron nitride abrasive grain, wherein the grinding wheel base material was 45 # steel. Put the grinding wheel blank into the heating furnace, and carry out vacuum liquid phase activation and sintering at a heating temperature of 960 °C and a holding time of 20 minutes to make the Cu-Sn-Ti alloy react with HBN particles and CBN abrasive particles, and then cool with the furnace to Bake at room temperature.
Embodiment 2
[0017] The Ti-containing alloy is an Ag-Cu-Ti alloy with a Ti content of 5% and a mass ratio of Ag and Cu of 72:28. The HBN particle diameter is 10 microns, and its mass accounts for 5% of the total mass of the binder layer material. The bond layer material (the mixture of Ag-Cu-Ti alloy and HBN particles) was mechanically stirred for 10 minutes, and then the grinding wheel blank was made in the order of grinding wheel metal matrix / bond layer material / cubic boron nitride abrasive grain, wherein the grinding wheel base material was Stainless steel 1Cr18Ni9Ti. Put the grinding wheel blank into the heating furnace, and carry out vacuum liquid phase activation and sintering at a heating temperature of 900 ° C and a holding time of 15 minutes to make the Ag-Cu-Ti alloy react with HBN particles and CBN abrasive particles, and then cool down with the furnace to Bake at room temperature.
Embodiment 3
[0019] The Ti-containing alloy is a Cu-Sn-Ti alloy with a Ti content of 10% and a mass ratio of Cu and Sn of 2:1. The HBN particle diameter is 10 microns, and its mass accounts for 10% of the total mass of the binder layer material. The bond layer material (the mixture of Cu-Sn-Ti alloy and HBN particles) was mechanically stirred for 10 minutes, and then the grinding wheel blank was made in the order of grinding wheel metal matrix / bond layer material / cubic boron nitride abrasive grain, wherein the grinding wheel base material was 45 # steel. Put the grinding wheel blank into the heating furnace, and carry out vacuum liquid phase activation and sintering at a heating temperature of 980°C and a holding time of 15 minutes to make the Cu-Sn-Ti alloy react with HBN particles and CBN abrasive particles, and then cool with the furnace to Bake at room temperature.
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