Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sealing device used for 10(-8)Pa ultra-high vacuum round plane magnetron sputtering target

An ultra-high vacuum and magnetron sputtering technology, which is applied in the sealing of engines, sputtering coating, vacuum evaporation coating, etc., can solve the problems of air leakage, water seepage, poor reflectivity, and poor solderability in the packaging, and achieve Easy to repair and replace, ensure the tightness, and ensure the effect of the tightness

Inactive Publication Date: 2008-03-26
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
View PDF1 Cites 19 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are deficiencies in this sputtering target. First of all, after the magnet seal cover is filled with pure iron, magnets and cooling system, if it is welded and packaged, it will be difficult to carry out necessary maintenance and maintenance of each component in it in the future. Replacement, if it is a cover-plate package, air leakage and water seepage will easily occur at the package; secondly, as the cathode, it needs to be electrically insulated from other parts in the sputtering equipment, and the insulating layer is made of non-metallic materials. Just can't use the mode of welding to solve mutual sealing problem; Again, because of the defect on the structure, the vacuum degree of sputtering equipment can only reach 10 -6 Pa, due to the low vacuum degree of the equipment, during the metal sputtering process, due to the presence of more water vapor molecules and oxygen molecules in the environment, the color of the metal layer will be abnormal, with gray and turbid areas, poor reflectivity and Defects such as poor solderability seriously affect the performance and yield of semiconductor devices and circuits

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sealing device used for 10(-8)Pa ultra-high vacuum round plane magnetron sputtering target

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0010] Referring to Fig. 1, soft iron 5 and magnetic steel 4 are built in the cavity of the water cooling chamber 3, the upper end of the water cooling chamber 3 is connected with the target mounting cover 2 through mutual threaded connection, and the lower end surface is connected with the water cooling chamber A ○-shaped metal sealing ring 7 composed of an aluminum wire sealing ring is placed between the upper end faces of the sealing flange 17 , and is fixedly connected by screws 22 . A through hole 6 is arranged on the side wall of the sealing flange 17 of the water cooling chamber, and one end of the through hole 6 communicates with the bottom of the screw 22 hole, and the other end communicates with the vacuum chamber. The water inlet pipe 20 sleeved in the water outlet pipe 19 passes through the soft iron 5 and is welded thereto. The outlet pipe 19 penetrates through the sealing flange 17 of the water cooling chamber and is welded to it. The upper end of the sealing fla...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses one kind of sealing device for 6x10<-8> Pa aultra high vacuum circular planar magnetically controlled sputtering target. The sealing device includes one water cooling cavity with soft iron and magnetic steel, one water cooling cavity sealing flange with metal O-ring, one water inlet pipe and one water outlet pipe welded to the water cooling cavity sealing flange, one target supporting seat with one electrode insulating layer and two groups of O-rings, one installing flange welded to the target supporting seat and other parts. The present invention can ensure vacuum degree as high as 6x10<-8> Pa.

Description

technical field [0001] The invention relates to a sealing device for a magnetron sputtering target, especially for 10 -8 Sealing device for Pa ultra-high vacuum circular planar magnetron sputtering target. Background technique [0002] After making various components on semiconductor materials, the process of connecting these components according to the requirements of circuit design to form integrated circuits with various functions is called metallization process. The quality of the metallization system and its process can affect the performance and reliability of the circuit. The sputtering process is one of the commonly used metallization processes. Because of the high energy of the deposited particles, the adhesion between the film and the substrate is better. The coverage is better, and the sputtering voltage is lower, which reduces the radiation damage to the substrate material, so it is widely used in semiconductor devices and circuit manufacturing processes and ot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35F16J15/08
Inventor 邱凯李新化钟飞尹志军解新建王玉琦
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products