Semiconductor encapsulation structure and its making process

Abstract

This invention relates to a semiconductor package structure including a lead frame, a first semiconductor chip wrapped in a first sealing colloid (such as ASIC), which includes a concave for containing a second semiconductor chip ( such as a pressure sensing chip) and a cover set on the concave of the first sealing colloid, a part of which is formed between the second semiconductor chip and the loader of the chip so that the second semiconductor chip is not set on the snug of the chip but on the place of the first sealing colloid.

Description

technical field [0001] The present invention relates to a semiconductor package structure, in particular to a semiconductor package structure with a plurality of semiconductor chips. Background technique [0002] With the ever-increasing demand for miniaturization and high operating speed, a semiconductor package structure with a plurality of semiconductor chips (ie, a multi-chip package structure) is becoming more and more attractive in many electronic devices. Multi-chip package construction minimizes the limitation on system operating speed caused by long printed circuit board connection lines by combining processor, memory and logic chips in a single package construction. In addition, the multi-chip package structure can reduce the length of the connection lines between chips and reduce signal delay and access time. [0003] However, in some applications (such as a tire pressure monitoring system used to monitor automobile tire pressure), it is desirable to integrate a ...

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Problems solved by technology

[0006] The object of the present invention is to provide a semiconductor packaging structure and its manufacturing process for tire pressure monitoring system, to overcome or at least improve the occurrence of delamination between the chip and the chip holder in the above-mentioned prior art, or chip warping or even cracking this question

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