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Microminiature power converter and thin film magnetic induction device thereof

By concentrating electrodes around the magnetic insulation substrate and forming gaps or slit-like grooves, the inductance value and efficiency of the micro power converter are improved, the problems of electrode-induced voltage and low efficiency are solved, and the size and cost are reduced. reduce.

Inactive Publication Date: 2008-06-11
FUJI ELECTRIC SYST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So, the problem is that the size of the semiconductor is ultimately limited by the size of the magnetic sensing element
When the thin film magnetic sensing element is minimized while reducing the size of the semiconductor element, the performance of the magnetic sensing element becomes worse, resulting in degraded efficiency of the power converter
In addition, a large induced voltage (voltage generated by the magnetic field action of the coil on the connecting conductor of the electrode) is generated on the electrode, which easily leads to failure of the semiconductor element (IC)

Method used

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  • Microminiature power converter and thin film magnetic induction device thereof
  • Microminiature power converter and thin film magnetic induction device thereof
  • Microminiature power converter and thin film magnetic induction device thereof

Examples

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example 1

[0077] Figures 1(a) and 1(b) show the basic parts of a micro power converter according to the first embodiment (Example 1) of the present invention, wherein Figure 1(a) is viewed from the first main plane (front) side View the plane view of the thin film magnetic induction element, and Fig. 1(b) is a cross-sectional view taken along the line Y-Y in Fig. 1(a). Although the micro power converter includes an IC chip and other components as shown in FIG. 11 , FIGS. 1( a ) and 1 ( b ) only show thin film magnetic induction elements, and those components are omitted.

[0078] The thin-film magnetic induction element comprises: a ferrite substrate 11, which is a magnetic insulating substrate; a solenoidal coil, formed in the inner region of the ferrite substrate 11; electrode pairs, arranged between the ferrite substrate 11 and the coil in the peripheral side region in the direction parallel to the axis, where each pair of electrodes 15 a and 15 b sandwich the ferrite substrate 11 ag...

example 2

[0104] Figure 5(a) and 5(b) show the structure of the basic part of the micro power converter according to the second embodiment (example 2) of the present invention, wherein Figure 5(a) is viewed from the first main plane side The plane view of the thin film magnetic induction element, and Fig. 5(b) is a cross-sectional view taken along line A-A in Fig. 5(a).

[0105] In this embodiment, a gap 50 having a configuration of passing through the slit of the ferrite substrate 11 is formed to extend from the via hole 12a connecting the electrode 15a on the first main plane with the electrode 15b on the second main plane. , and the electrodes 15a and 15b are electrically connected through the connecting conductor 12b. Providing the gap 50 with a slot configuration reduces the width of the ferrite substrate 11 outside the electrodes 15a, 15b, thereby reducing the peripheral magnetic flux 43 flowing outside the electrodes 15a, 15b. When the through hole 12a and the slit-shaped gap 50...

example 3

[0109] Fig. 7 (a) and 7 (b) have shown the basic part according to the miniature power converter of example 3 of the present invention, wherein Fig. 7 (a) is the plan view of the thin film magnetic induction element viewed from the first main plane side, and Fig. 7(b) is a sectional view taken along line A-A in Fig. 7(a).

[0110] In Example 3, the oval-shaped through hole 12a connecting the electrode 15a on the first main plane and the electrode 15b on the second main surface is different from that of Example 2 shown in FIGS. 5(a) and 5(b). The point is that the elliptical-shaped through-hole 12a extends to the outer peripheral end portion of the ferrite substrate 11, thereby forming a slit-shaped gap 60 that intercepts the outer peripheral magnetic flux 43. This slit-like gap 60 passes completely through the ferrite substrate.

[0111] Since the portion of the ferrite substrate outside the electrodes 15a, 15b is completely removed, the outer peripheral magnetic flux 43 flow...

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Abstract

A microminiature power converter includes a thin film magnetic induction device including a ferrite substrate and a solenoid coil conductor extending along the first and second principal planes of the substrate with the conductor extending through through-holes formed in the substrate to form a coil configuration. Electrodes are positioned near the peripheral region of the substrate and are collectively arranged at least one along the direction parallel to the axis of the solenoid coil formed by the conductor. The length of the coil can be increased to increase the inductance value of the coil. Gaps or grooves are provided near or in the peripheral region of the ferrite substrate to reduce induced voltage appearing in the electrodes.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims the benefit of priority from Japanese Patent Application No. 2006-330786 filed on December 7, 2006, the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a miniature power converter (power converter) such as a DC-DC converter composed of a semiconductor integrated circuit (hereinafter referred to as IC) formed on a semiconductor substrate and passive components such as coils, capacitors, and resistors . Background technique [0004] Recently, electronic information devices, especially mobile electronic information devices of various types, have become quite common. Most of such electronic information devices have batteries for power supply, and contain power converters such as DC-DC converters. Power converters are usually constructed as hybrid power modules, where active components such as switching elements, rect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M3/155H01F30/00H01F17/00H01L25/00
CPCH01F27/29H01F27/40H01F27/2804H01F2027/2819H01L2224/73204
Inventor 江户雅晴广濑隆之
Owner FUJI ELECTRIC SYST CO LTD
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