Ultra-thin sheet material pulsed laser micro rivet connection method and special-purpose device thereof

A pulsed laser and plate technology, which is used in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problem that the plate cannot be directly connected, and achieve the effect of low cost, guaranteed sealing performance, and fast riveting speed.

Inactive Publication Date: 2008-07-09
SHANDONG UNIV
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Problems solved by technology

This patent provides a plastic forming method, but it cannot be directly used in the joining process between sheets

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  • Ultra-thin sheet material pulsed laser micro rivet connection method and special-purpose device thereof

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Embodiment Construction

[0025] The details and working conditions of the technical solution proposed by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Fig. 1 is a schematic diagram of the ultra-thin plate pulsed laser micro-riveting device of the present invention, including a laser generator control system 1, a laser generator 2, and a laser beam 3 emitted by the laser generator 2 connected in sequence; the fixture system includes a constrained layer 4 , an energy absorbing layer 5, a plate 6, a plate 7, and a rigid backing plate 8;

[0027] The laser generator 2 generates a pulsed laser beam 3, and the energy, laser mode, spot size, pulse number, and pulse width of the laser beam 3 are regulated and controlled by the control system 1 of the laser generator.

[0028] Fig. 2 is a schematic diagram of the fixture system in the riveting process. In the figure, the plate 6 has formed a plastic protrusion on the surface due to the impact of...

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Abstract

The invention discloses an ultrathin plank stuff pulse laser micro-riveting method and a special device for realizing the method. The method relates to a method which leads laser acted on a plank stuff to form a flexible convex mold and pivots double-layer or multi-layer plank stuff together. An optimized scheme is to lead laser on an energy absorption layer covered on the surface of the plank stuff under the action of a restraint layer to generate plasma detonation waves which are used as a flexible convex mold and then act on the plank stuff to pivot double-layer or multi-layer plank stuff together. The special device realizing the ultrathin plank stuff pulse laser micro-riveting method consists of a laser generator system, a frock clamper system and a working platform system. Through the method can process the metal materials like steel, aluminum and copper, etc., and can also process the non-metal material like silicon and plastic. The invention is in particular suitable for micro-apparatus part manufacture like the fields of pivoting of a metal contact of a micro-switch and forming the micro-electric packaging for the contact area.

Description

technical field [0001] The invention belongs to the field of advanced manufacturing, and in particular relates to a pulse laser micro-riveting method for ultra-thin plates and a special device for realizing the method. Background technique [0002] There are many ways to connect plates, including welding and riveting. The usual riveting method is mechanical riveting with rivets. This method has a firm connection, but it is difficult to ensure airtightness. The riveting method of connecting plates together with a spot welding machine is often called riveting welding. This method can ensure the sealing of the joint, but it has its limitations when used for the connection between different materials. Sometimes the two materials are difficult to spot weld. Together, at the same time, due to the heat-affected zone during spot welding, it makes the method difficult to use in fields such as micromanufacturing and microelectronic packaging. [0003] Chinese patent document CN13856...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/18B23K26/42B23K26/00B23K26/20B23K26/70
Inventor 季忠刘韧王佃刚张明浩宿庆财
Owner SHANDONG UNIV
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