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A distributed online detection system for ultrasonic lead key connection quality

An ultrasonic lead wire and detection system technology, applied in semiconductor/solid-state device testing/measurement, electrical components, electric solid-state devices, etc., can solve problems such as mutual influence between piezoelectric sensors and transducers, and changes in the structural characteristics of transducers. To achieve the effect of convenient online inspection, no interference with the production environment, and low cost

Inactive Publication Date: 2008-08-13
XI AN JIAOTONG UNIV
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AI Technical Summary

Problems solved by technology

The main disadvantage of this method is that there is an interaction between the piezoelectric sensor and the transducer, and the additional mass of the piezoelectric sensor will change the structural characteristics of the transducer

Method used

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  • A distributed online detection system for ultrasonic lead key connection quality
  • A distributed online detection system for ultrasonic lead key connection quality
  • A distributed online detection system for ultrasonic lead key connection quality

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Embodiment Construction

[0026] (1) Technical points of the invention

[0027] 1. In the way of information acquisition, based on the self-sensing characteristics of the piezoelectric transducer of the ultrasonic bonding system, the present invention directly obtains the input ultrasonic signal of the piezoelectric transducer, and uses this signal as an information carrier for identifying the bonding quality. Then, the bonding quality is identified by signal feature extraction and pattern recognition technology. Therefore, there is no need to install any sensors on the pad or on the transducer, which is low cost and does not interfere with the production environment.

[0028] 2. Aspect information processing and system realization, the present invention utilizes DSP processor to carry out data acquisition and preprocessing, has improved the speed of data processing and detection system, and constitutes distributed system with detection center computer, can realize easily to a plurality of On-line pat...

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Abstract

The invention discloses a binding point quality on-line detection system of a distributed ultrasonic wire bonding system. The system comprises: a quality detection center DTC composed of a main computer, a databank server and a network printer; a local area network bus and a gateway server; and a DSP terminal composed of an isolating amplifier circuit, a switching value converting circuit, an A / D converting circuit, a DSP(Digital Signal Processing) processor, a DSP external expanding program memory, a DSP external expanding data memory and a DSP communication module. The invention takes the input electrical signal of the ultrasonic wire bonding system piezoelectric transducer as the information carrier to identify the bonding quality and applies the DSP terminal to collect, pretreat the electrical signal and transmits the data to the quality detection center via the local area network and realizes the bonding quality on-line detection of the ultrasonic bonding system through the bonding quality on-line and detection program set in the host computer.

Description

technical field [0001] The invention belongs to the field of IC (Integrate Circuit) microelectronic packaging quality detection and control, and can be further extended to related application fields related to signal processing, in particular to a distributed ultrasonic wire bonding quality online detection system. Background technique [0002] Ultrasonic wire bonding is one of the most important technologies in IC chip interconnection. Provides the interconnection of pins between the chip and the substrate. It refers to bonding the wire (gold wire or aluminum wire) to the bottom pad of the chip under the normal temperature environment through the ultrasonic vibration generated by the piezoelectric transducer and the pressure of the bonding tool. 1), so as to connect the chip and the circuit of the substrate together. The quality of the bonding point will directly affect the performance of the IC chip, and a small bonding point failure may cause the failure of the entire I...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66
CPCH01L24/78H01L2224/45124H01L2224/45144H01L2224/78H01L2224/78301H01L2924/00014H01L2924/00H01L2224/48H01L2924/00012
Inventor 冯武卫孟庆丰詹华
Owner XI AN JIAOTONG UNIV
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