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Superplastic nano AlN ceramic material and preparation method thereof

A ceramic material and superplastic technology, applied in the field of preparation of superplastic nano-AlN ceramic materials, can solve the problems of affecting the plastic properties of materials, grain brittle fracture, difficult to control grain size growth, etc., and achieve excellent superplastic properties, Excellent comprehensive mechanical properties

Inactive Publication Date: 2008-09-03
YANSHAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the shortcomings of the preparation process of aluminum nitride ceramic materials mainly include: it is difficult to control the grain size growth during the sintering process, and the average grain size of the prepared material is relatively large, generally between several hundred nanometers to several microns , during the deformation process, a large number of dislocations are generated inside the grains, resulting in brittle fracture of the grains, which affects the improvement of the plastic properties of the material, making it difficult for the material to have superplasticity

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] (1) Mix molybdenum (Mo) powder with an average grain diameter of 1 μm and silicon (Si) powder with 5 μm according to the ratio of Mo:Si=33.3:66.7 in atomic percentage, and perform mechanical alloying in a high-energy ball mill ball milling. The mechanical alloying parameters are as follows: the ball-to-material ratio is 10:1, the milling speed is 600 rpm, and the milling time is 96 hours. A sintering aid powder is obtained.

[0018] (2) Mixing nano-AlN powder with an average grain diameter of 50nm and the prepared molybdenum-silicon powder sintering aid, the mass ratio of the sintering aid being 10% respectively.

[0019] (3) Put the mixed powder into the graphite mold for pre-compression, and then put the mold into the sintering furnace.

[0020] (4) Load to 30MPa, vacuumize and fill with nitrogen for protection.

[0021] (5) The temperature is raised to 1600°C, and the holding time is 60 minutes.

[0022] (6) With the furnace cooling down, take out the sample.

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Abstract

The invention discloses a preparation method for superplastic AlN ceramic nano-materials, which is characterized in that: (1) preparation of molybdenum silicon powder sintering additives: mixing the molybdenum powder with an average grain diameter of 1-10 Mum with silicon powder in a certain proportion and then ball-milling the mixture in a high-energy ball mill in a mechanical alloying method; (2)mixing powders: mixing the AlN powder with a nanometer average grain diameter of 10-100 nm with the produced molybdenum silicon powder sintering additives, wherein the mass percentage of the additives is 1%-20%; (3) sintering technology: hot pressing or discharge plasma sintering, the sintering technology has the same sintering process as the common AIN sintering process, which a nitrogen protection is required by filling nitrogen after vacuum pumping. The superplastic AlN ceramic nano-material with a grain diameter between 50nm-200nm can be hot press molded or superplastic formed, thereby solving the problem that ceramic parts with complex shape are difficult to be formed.

Description

technical field [0001] The invention relates to a preparation method of a ceramic material, in particular to a preparation method of a superplastic nano-AlN ceramic material. Background technique [0002] In 1986, the Nagoya Institute of Industrial Technology reported the tensile superplasticity of polycrystalline ceramics, and they discovered 3Y-TZP (3mol%Y 2 o 3 Stabilized ZrO 2 Polycrystalline) can produce a uniform tensile deformation of >120%. This report has led to extensive research on ceramic superplasticity worldwide. Except Y-TZP material, Al 2 o 3 、Al 2 o 3 -ZrO 2 Composite material, mullite, Si 3 N 4 、Si 3 N 4 - Ceramic materials such as SiC composites have also been found to exhibit some degree of superplasticity. In the past 20 or 30 years, with the rapid development of microelectronics technology, especially hybrid integrated circuits and multi-chip components have put forward higher and higher requirements for packaging technology, and substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/581C04B35/63C04B35/64
Inventor 骆俊廷
Owner YANSHAN UNIV
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