Normal pressure micro heat pipe vacuum liquid-injecting packaging process
A technology of micro heat pipe and liquid injection, applied in indirect heat exchangers, lighting and heating equipment, etc., can solve the problems of air mixing, numerous devices, isolation, etc., and achieve the effect of controlling air mixing and less equipment
Inactive Publication Date: 2011-09-07
HARBIN INST OF TECH
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Problems solved by technology
In the first method, the high-vacuum ester applied to the gap between the silicone spacer and the micro heat pipe cannot completely isolate it from the air, and there is still a small amount of air in the 2mm through hole, so there will be air mixed in when the liquid is injected. In the micro heat pipe, the performance of the micro heat pipe is degraded
In the second way, the devices used are numerous and complicated, which is not conducive to actual operation, and increases the cost of the experiment
Method used
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[0015] The present invention will be further described below in conjunction with specific examples with reference to the accompanying drawings.
[0016] figure 1 Schematic diagram of liquid injection for the micro heat pipe. Among them: 1. Micro heat pipe channel; 2. Silicone resin; 3. Liquid injection hole; 4. Vacuum pump; 5. Syringe; 6. Liquid distributor.
[0017] figure 2 Schematic diagram of micro heat pipe degassing, liquid injection and quantitative injection equipment. Among them: 1. Rotary vane pump; 2. Soda valve device; 3. Turbomolecular pump; 4. Flow meter; 5. Heating tube; 6. Liquid nitrogen cooling tube; 7. K-type thermocouple; 8. Film pressure 9. Mass measuring device; 10. Liquid injection valve; 11. Micro heat pipe array.
[0018] image 3 Schematic diagram of the injection process. Among them: 1. Large glass dish containing water; 2. Vibration equipment; 3. Small glass dish containing a certain amount of ethanol; 4. Micro heat pipe; 5. Liquid injection ...
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The invention discloses a method of vacuum charge packaging for a micro heat pipe, which includes charge and encapsulation two processes. As air in the cavity of the micro heat pipe and operating fluid has a strong impact on the performance of the micro heat pipe, thus the invention firstly adopts the pattern of combining vacuum-pumping and supersonic vibration to fill the whole cavity with microheat pipe working fluid; in the process of encapsulation, the invention adopts the way of heating-cooling to cause the internal of the micro heat pipe to achieve vapor-liquid dynamic balance, so as to enable the amount of charge controllable, lastly the charge hole is sealed by glue. Compared with the available technology, the invention has the advantages of low cost and simple operation, and theinvention can guarantee high vacuum degree in the cavity of the micro heat pipe.
Description
(1) Technical field [0001] The invention relates to the encapsulation technology of micro heat pipes, in particular to a method for vacuum liquid injection encapsulation of silicon micro heat pipes under normal pressure. (2) Background technology [0002] With the rapid development of IC manufacturing technology, the number of transistors integrated on a single chip has reached hundreds of millions, the power consumption and chip connection density are getting higher and higher, and the available heat dissipation area is small, which makes the heat flux density increase sharply and the chip temperature rise significantly. Affect its working reliability and service life. Traditional cooling technologies such as forced convection cooling with a fan combined with a heat sink, and semiconductor thermoelectric cooling technology can no longer meet the heat dissipation requirements of the further development of integrated circuits due to constraints such as heat transfer capacity ...
Claims
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IPC IPC(8): F28D15/02
Inventor 刘晓为王超霍明学王喜莲徐磊
Owner HARBIN INST OF TECH