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Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board

一种制造方法、布线板的技术，应用在电气元件、印刷电路制造、电路等方向，能够解决引线框架202的电路图案稀疏、难半导体电路部件安装在同一基板上等问题

Inactive Publication Date: 2008-09-24
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In addition, in the above-mentioned existing structure, in order to drive the LED 206, a large current such as 100A (A is an ampere, the current unit) is required. In addition, in order to dissipate heat from the LED 206, the lead frame 202 is formed on the wiring board. 202 is further thickened, as a result, the circuit pattern of the lead frame 202 becomes sparse, and it is difficult to mount the semiconductor circuit components for driving the LED 206 on the same substrate.

Method used

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  • Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board
  • Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board
  • Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board

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no. 1 approach

[0047] The first embodiment will be described using the drawings.

[0048] Figure 1A It is a perspective view which shows the state which mounted LED on the heat radiation wiring board of 1st Embodiment, Figure 1B yes Figure 1A partial sectional view.

[0049] exist Figure 1A Among them, high heat generation and large current elements such as LED 102 are mounted on the thick lead frame 100 used as a circuit pattern. A control IC 104 and a chip component 106 for controlling the LED 102 are also mounted on the same lead frame 100 of different thickness. The different-thickness lead frame 100 is integrated with the heat dissipation plate 110 disposed under the composite resin plate 108 via the composite resin plate 108 . The heat sink 110 is bonded to the composite resin board 108 in a non-conductive state with the lead frame 100 of different thickness. In addition, the terminal electrodes for mounting, such as the LED 102 and the control IC 104, are not shown in figure...

no. 2 approach

[0075] Hereinafter, as a second embodiment, using Figure 3A , Figure 3B , Figure 4 , Figure 5 An example of a method of manufacturing a heat dissipation wiring board using a lead frame having a different thickness will be described.

[0076] Figure 3A , Figure 3B It is a perspective view explaining the production of the lead frame 100 of different thickness, Figure 3A represents the state of the copper material 122 before pressurization, Figure 3B The state of the copper material 122 after pressurization is shown. Figure 3A Among them, the copper material 122 is a continuous special-shaped copper strip processed from a thin plate mainly composed of copper, for example, by roll forming or the like. as follows Figure 3B As shown, the copper material 122 is formed into a predetermined shape by press molding. At this time, it is best to carry out the pressurization work from the back side to the surface side (in the Figure 3B Middle is from bottom to top). In...

no. 3 approach

[0082] Hereinafter, as the third embodiment, use Figure 6 ~ Figure 8 An example of optimum mounting of various electronic components on a heat dissipation wiring board will be described. Figure 6 It is a perspective view explaining the position of mounting components on the heat dissipation wiring board.

[0083] Figure 6 Among them, the thick part 112 of the different-thickness lead frame 100 has excellent high current and heat dissipation properties, and this part is preferably used as a large current heat dissipation part 128 to mount power components 134 such as LEDs. On the other hand, since the thin portion 114 of the variable-thickness lead frame 100 can form fine and complicated wiring, it is most suitable as the signal circuit portion 130 and suitable for mounting the control component 132 .

[0084] Also, yes Figure 6 The surface (component mounting surface) of the variable-thickness lead frame 100 is subjected to nickel-based tin plating. In this way, it can...

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PUM

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Abstract

To solve a problem that an electronic component such as conventional LEDs wherein a large current and heat dissipation are required is difficult to be mounted on a same substrate with other general electronic components. A lead frame having a partially different thickness is used, the special electronic component such as the LEDs wherein a large current and heat dissipation are required is mounted on the thick portion, fine pitch wiring is provided on the thin section, and the general electronic components are mounted at a high density. Thus, requirements for having, as a unit or a module, the electronic component wherein a high heat dissipation and a large current are required are met.

Description

technical field [0001] The present invention relates to a heat dissipation wiring board, its manufacturing method, and electrical equipment using the heat dissipation wiring board. Background technique [0002] In recent years, along with the demand for higher performance and miniaturization of electronic equipment, there has been a higher demand for higher density and higher performance of electronic components. Therefore, the temperature rise of electronic components due to the miniaturization, high performance, and high mounting of electronic components has become a major problem, and the method of improving the heat dissipation capability of electronic components is particularly important. Hereinafter, an LED will be described as an example of an electronic component where heat generation becomes a problem. [0003] Even among electronic parts, LEDs have the characteristic that the amount of light emitted decreases due to an excessive rise in temperature, and heat dissi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/50
CPCH05K3/202H05K2201/09736H01L2924/0002H05K1/056H05K1/0203H01L33/647H01L23/3735H05K2201/10106H01L23/145H01L33/642H01L23/142H05K2201/0209H01L23/49861Y10T29/49128Y10T29/49162H01L2924/00
Inventor 津村哲也西山公治辻本悦夫
Owner PANASONIC CORP