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Modified polyphenylene oxide resin composition comprising carbon nano tube

A technology of polyphenylene ether resin and resin composition, used in rigid containers, containers, packaging, etc., can solve the problems of non-resistance supply at the injection gate part, pollution of the packaging part, poor surface resistance of semiconductors, etc.

Inactive Publication Date: 2008-10-08
SHINIL CHEM IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] Therefore, in order to solve the problems of the current MPPO resin composition containing carbon fiber, that is, the pollution of the packaging part, the poor surface resistance of the semiconductor, the non-resistance of the injection grid part, and the unstable supply, etc. The material has been carefully studied and confirmed that if carbon nanotubes are used to manufacture semiconductor chip trays, they can exhibit more excellent surface resistance than before, exhibit improved heat resistance, dimensional stability, and rigidity, and show twist properties and surface appearance Excellent properties, thereby completing the present invention

Method used

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  • Modified polyphenylene oxide resin composition comprising carbon nano tube
  • Modified polyphenylene oxide resin composition comprising carbon nano tube
  • Modified polyphenylene oxide resin composition comprising carbon nano tube

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Embodiment 1～20

[0055] Examples 1-20: Manufacture of modified polyphenylene ether (MPPO) resin composition

[0056] The carbon nanotube-containing MPPO resin composition of the present invention was produced with the compositions and contents shown in Tables 1 and 2 below.

[0057] The composition of Table 1 is a composition used for a semiconductor tray whose baking temperature of a semiconductor is 150 degreeC, and the composition of Table 2 is a composition used for a semiconductor tray whose baking temperature of a semiconductor is 130 degreeC.

[0058] In the composition, the viscosity of the PPO resin used is 0.4dl / g product (manufactured by Asahi), and the carbon nanotube uses the product (average diameter 20nm, average length 10 μm, Purity above 90UT%, aspect ratio (ASPECT RATIO) above 500).

[0059] The glass fiber uses CS03-165A manufactured by Korea's Austin (オエンスココニン) company, and the mineral filler uses a mixture of 60 to 75% by weight of silicon dioxide and 25 to 40% by weigh...

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Abstract

The present invention relates to conductivity modified polyphenylene oxide (MPPO) resin composition comprising carbon nano tube (CNT), in more detail, relating to a MPPO resin composition with excellent heat-resisting quantity, dimension stability and electroconductivity, the MPPO resin composition containing (a) 20-60 wt% polyphenylene oxide, (b) 10-30wt% fiberglas, (c) 10-20 wt% mineral filler, (d) 0.5-5 wt% carbon nano tube and (e) 10-30 wt% high impact polystyrol.The MPPO resin composition of the present invention displays 102-109Omega by using the carbon nano tube, especially optimum surface resistance at certain area belt 104-109 Omega, improving heat-resisting quantity, dimension stability and rigidity. Comparing with the present carbon fibre, various things represented with surface conditions, tortility property and so on are more excellent, and can saving cost of manufacture to produce trays products, can using in electric and electronic field effectively, especially semi-conductor packaging field.

Description

technical field [0001] The present invention relates to a conductively modified polyphenylene ether (MPPO) resin composition containing carbon nanotubes (CNT), in more detail, to a MPPO resin composition having excellent heat resistance, dimensional stability and electrical conductivity , the MPPO resin composition contains (a) 20-60% by weight of polyphenylene ether, (b) 10-30% by weight of glass fiber, (c) 10-20% by weight of mineral filler, (d) 0.5-5% by weight of carbon Nanotubes and (e) 10-30% by weight of high-impact polystyrene. Background technique [0002] The existing semiconductor chip tray (IC Tray) mainly uses acrylonitrile-butadiene-styrene copolymer (ABS), polyphenylene ether (PPO) or polyphenylene ether (PPE), and polysulfone (PSF) or polysulfone (PSF) Ethersulfone (PES) resin mixed with carbon fiber (Carbon fiber) or conductive carbon black (Carbon black) and other inorganic fillers (glass fiber, talc, mica, kaolin, wollastonite, etc.) to manufacture. [...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08K7/14C08K3/00C08K7/00C08K3/04B65D19/00
CPCC08K3/22C08K3/36C08K7/06C08K7/28C08K9/06C08K2003/222C08K2201/003C08K2201/011C08L25/06C08L71/126
Inventor 徐今锡南炳旭郑俊硕
Owner SHINIL CHEM IND CO LTD
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