Earth silicon vesicle material with controllable shape, dimension and thickness of wall and method for preparing same
A technology of silica and vesicles, applied in the field of porous materials, to achieve the effects of simple operation, rich structure, great possibility and selectivity
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Embodiment 1
[0030] Add 0.2g B50-6600 and 0.3g P65 mixed surfactant into 30g pH=4.7NaAC-HAc[c(HAc)=c(NaAc)=0.4M] buffer solution, stir at 25°C to make the surfactant Dissolve completely, add 0.008mol TEOS and 0.002mol TMOS mixed silicon source to the system, continue to stir for 40 minutes, let stand for 24 hours, heat at 100°C for 24 hours, suction filter, wash, dry, and bake at 550°C for 5 hours. get figure 1 (a) Shaped vesicle material.
Embodiment 2
[0032] Add 0.5g B50-6600 into 30g pH=4.7NaAC-HAc[c(HAc)=c(NaAc)=0.4M] buffer solution, stir at 25°C to completely dissolve the surfactant, add 2.08 g TEOS, continue to stir for 20 minutes, let stand for 24 hours, heat at 100°C for 24 hours, filter with suction, wash, dry, and bake at 550°C for 5 hours. get figure 1 (b) Shaped vesicle material.
Embodiment 3
[0034] Add 0.5g B50-6600 mixed surfactant into 30g pH=4.7NaAC-HAc[c(HAc)=c(NaAc)=0.4M] buffer solution, stir at 25°C to completely dissolve the surfactant, and add Add 0.01mol TEOS and 0.004mol TMOS mixed silicon source into the system, continue to stir for 40 minutes, let stand for 24 hours, heat at 100°C for 24 hours, suction filter, wash, dry, and bake at 550°C for 5 hours. get figure 1 (c) Vesicle-like material.
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