Cleaning agent for grinding wafer
A cleaning agent and wafer technology, applied in detergent compounding agent, detergent composition, organic cleaning composition, etc., can solve the problem that the RCA cleaning method cannot meet the grinding and cleaning requirements of 300mm wafers, consumes a large amount of chemical reagents, and cleans The problem of high cost can reduce the corrosion rate of the wafer, improve the cleaning ability, and reduce the cleaning cost.
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Embodiment 1
[0033] A cleaning agent for wafer grinding is characterized in that it is composed of a surfactant, a fluorine-containing carboxylic acid, a fluoride salt, a pH regulator, a penetrating agent, a chelating agent, and pure water.
[0034] Its raw materials and weight percent are as follows:
[0035] Surfactant 5%-20%, fluorine-containing carboxylic acid 0.1%-10%, fluoride salt 0.01-5%, pH regulator 5%-20%, penetrant 2%-5%, chelating agent 0.1%-2 %, the balance of pure water.
[0036] Each raw material is selected within its weight range, and the total weight is 100%.
[0037] Described surfactant is fatty alcohol polyoxyethylene ether (AEO), and general molecular formula is respectively R 1 O(C 2 h 4 O) m , where R 1 It is an alkyl group of C10-C18, m: the polymerization number of ethylene oxide group, and the polymerization number is 3-20.
[0038] The fluorine-containing carboxylic acid is C 6 f 13 COOH, C 8 f 17 COOH, C 9 f 19 COOH, C 11 f 23 At least one of CO...
Embodiment 2
[0054] Raw materials and weight percentages are as follows:
[0055] AEO-15 10%
[0056] Perfluorohexanoic acid 3%
[0058] Triethanolamine 10%
[0059] JFC Penetrant 3%
[0060] Chelating agent 0.5%
[0061] Pure water balance.
[0062] The sum of the weight percentages of each raw material is 100%, and the cleaning method and effect are the same as in Example 1.
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