F-level heat-proof solvent-impregnated resin suitable for subatmospheric pressure and normal temperature

A technology of vacuum pressure and resin impregnation, which is applied in the direction of plastic/resin/wax insulators, organic insulators, etc. It can solve the problems of high toxicity, volatile and polluting the environment, achieve slow viscosity growth, good storage stability, and improve electrical pulse resistance effect of ability

Active Publication Date: 2008-12-10
上海同立电工材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the technical problems to be solved by the present invention is to provide a clean and environmentally friendly impregnating resin that does not contain active diluents such as styrene, in view of the shortcomings of the original impregnating resin, which are highly toxic and volatile and pollute the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A grade F heat-resistant impregnating resin suitable for vacuum pressure and normal temperature. It is obtained by uniformly mixing 100 parts of component A and 80-120 parts of component B. Epoxy resin, 10 parts of ethylene glycol diglycidyl ether and 2 parts of methyl hydroquinone are mixed into component A; 80 parts of methyl tetrahydrophthalic anhydride and 10 parts of dioctyl phthalate are mixed into component B.

[0030] Wherein, component B may specifically be one of 80 parts, 85 parts, 90 parts, 95 parts, 100 parts, 105 parts, 110 parts, 115 parts and 120 parts.

[0031] A preparation method of F-class heat-resistant impregnating resin suitable for vacuum pressure and normal temperature. The two components are uniformly mixed with 100 parts of A component and 80-120 parts of B component to light yellow, uniform and transparent impregnating resin. Among them,

[0032] a) Add stabilizer to type I and type II mixed epoxy resin, mix and stir at room temperature or be...

Embodiment 2

[0040] In the present embodiment, type II hybrid epoxy resin is selected neopentyl glycol diglycidyl ether; stabilizer is selected p-tetyl phenol; plasticizer is selected diallyl phthalate, and acid anhydride is selected methyl hexahydrophthalic anhydride ; The parts by weight of each component are respectively:

[0041] Bisphenol A type epoxy resin 65 parts

[0042] Neopentyl glycol diglycidyl ether 35 parts

[0043] 2.5 parts of p-tertyl phenol

[0044] 85 parts of methyl hexahydrophthalic anhydride

[0045] Diallyl phthalate 15 parts

[0046] Others are the same as in Example 1.

Embodiment 3

[0048]In the present embodiment, type II hybrid epoxy resin is selected diglycidyl ether; the stabilizer is selected 2,4-di-tert-butylphenol; the plasticizer is selected dioctyl terephthalate, and the acid anhydride is selected methyl nadic anhydride; The parts by weight of each component are respectively:

[0049] Bisphenol A type epoxy resin 70 parts

[0050] Diglycidyl ether 30 parts

[0051] 2,4-di-tert-butylphenol 3 parts

[0052] Methyl nadic anhydride 90 parts

[0053] Dioctyl terephthalate 10 parts

[0054] Others are the same as in Example 1.

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PUM

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Abstract

The invention discloses an F-grade heat-resisting solvent impregnated resin suitable for vacuum pressure and normal temperature. The F-grade heat-resisting solvent impregnated resin is prepared by mixing 100 portions of a composition A and 80 to 120 portions of a composition B, wherein, according to weight portion, the composition A is prepared by mixing 60 to 90 portions of I-epoxide resin, 10 to 40 portions of II-epoxide resin and 2 to 4 portions of a stabilizing agent; the composition B is prepared by mixing 80 to 120 portions of fluid estolide and 10 to 20 portions of a plasticizer; and the I-epoxide resin is a bisphenol A-type expoxide resin. The composition A and the composition B are respectively packaged and stored separately and are used by mixing according to the ratio of 1 to 0.8-1.2. The solvent impregnated resin is used together with special dry mica tape and special moderate-resin mica tape which contain a curing accelerating agent and are matched with the solvent impregnated resin specially. The F-grade heat-resisting solvent impregnated resin has the advantages of cleanliness, environment protection, rapid high temperature solidification, small mass loss in the curing process and high purity quotient of each component.

Description

technical field [0001] The invention relates to an impregnating resin, in particular to a vacuum pressure impregnating resin which does not contain a styrene active diluent and is suitable for the VPI impregnation of the stator windings of F-class high-voltage motors and electric appliances, and the impregnation and coil VPI of generators. At the same time, it also relates to the preparation, use method and application of the impregnating resin. Background technique [0002] In the manufacturing technology of high-voltage motors and power generation equipment, the performance of insulating materials and the stability of long-term use are one of the core technologies of products. Issues such as thinning the insulation thickness, improving the temperature resistance level of the product, improving the thermal mechanical properties of the insulation structure, reducing the "three wastes" emissions in the production process, reducing energy consumption, and improving production ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08K5/00C08K5/09H01B3/40
Inventor 倪永庆李雪
Owner 上海同立电工材料有限公司
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